Qubit Coupling Over Distance With Multi-Mode Interposer Buses
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Solution Overview
Problem
In quantum computing, coupling qubits over distance is challenging without affecting qubit measurements and state quality, especially as quantum computing devices expand, leading to issues like crosstalk and decoherence due to conventional short coupling distances and hardware limitations.
Innovation Solution
A system comprising a first qubit chip and a second qubit chip electrically coupled by a plurality of coupling elements, including resonators, with an interposer chip connecting these elements, allowing for series-connected capacitively-coupled qubits over distances greater than 1 cm, providing a clean spectrum and galvanic isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If qubits are coupled using conventional short coupling distances, then coupling strength is sufficient, but qubit measurement quality and state quality deteriorate due to crosstalk and decoherence
Solution Approach 1:
The patent introduces an interposer chip as an intermediary component between separate qubit chips. This interposer contains coupling elements (resonators) that mediate the interaction between qubits on different chips, enabling coupling over distances greater than 1 cm while maintaining measurement quality and reducing crosstalk through galvanic isolation.
Solution Approach 2:
The patent divides the quantum computing system into separate qubit chips that are coupled through an interposer chip. This segmentation allows each qubit chip to be independently optimized and manufactured, while the interposer provides controlled coupling pathways that maintain signal integrity over longer distances.
2Adaptability or versatility
If qubit chips are connected over distances greater than 1 cm, then modularity and scalability improve, but signal noise and interference increase
Solution Approach 1:
The interposer chip acts as an intermediary that provides controlled coupling pathways between distant qubit chips. It uses resonators and capacitive coupling elements to transmit quantum signals over distances greater than 1 cm while filtering out noise and maintaining signal integrity through designed coupling strengths.
Solution Approach 2:
The patent creates an electrically isolated environment between qubit chips through the interposer structure, which provides galvanic isolation. This isolates the qubit systems from external electrical noise and interference while allowing controlled quantum interaction through the resonator-based coupling elements.
3Productivity
If multiple qubit chips are coupled together, then system scalability increases, but control line complexity and device complexity increase
Solution Approach 1:
The patent segments the quantum system into modular qubit chips that can be independently manufactured and tested. Each chip contains its own qubits and local control infrastructure, reducing the complexity of individual components while enabling scalable assembly of larger systems through standardized interposer interfaces.
Solution Approach 2:
The interposer chip serves multiple functions: it provides galvanic isolation between qubit chips, implements controlled coupling through resonators, and manages signal routing between distant qubits. This multi-functionality reduces the need for separate control lines and simplifies the overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective coupling of qubits over longer distances with reduced noise and interference, enhancing modularity and operational flexibility in quantum computing setups, while maintaining qubit coherence and quality.
Implementation Method 1
The coupling elements can be resonators, such as coplanar waveguide resonators, that can be capacitively-coupled to one another
Implementation Method 2
a superconducting quantum interference device can be disposed at each of at least a pair of tunable coupling elements of the coupling elements
Data Source
AI summary
Technology provided herein relates to coupling of qubits to one another. A system can comprise a first qubit chip and a second qubit chip, a plurality of coupling elements electrically coupling together the first qubit chip and the second qubit chip, and an interposer chip electrically coupling together the plurality of coupling elements. In another embodiment, a system can comprise a first chip comprising a plurality of first qubits, a second chip comprising a plurality of second qubits, and an interposer chip electrically connected between the first chip and the second chip, wherein individual first qubits, of the plurality of first qubits, are electrically coupled to individual second qubits, of the plurality of second qubits, and wherein the electrical coupling of the individual first qubits to the individual second qubits is by series-connected sets of capacitively-coupled elements over the interposer chip.