Quantum Qubit Interposer Layout for Vertical Signal Routing
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Solution Overview
Problem
Current quantum computing architectures face challenges in scaling up due to spatial issues with wirebonding, on-chip routing difficulties, and decreasing chip yield as the number of qubits increases, along with the fragility of qubits leading to decoherence.
Innovation Solution
A quantum computing apparatus utilizing an interposer with a rigid connection element positioned orthogonally to the substrate layer, providing electrical connections through conductive elements like transmission lines, allowing for a scalable and efficient layout of qubits and circuit components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lateral wirebonding is used to connect qubits, then electrical connections can be established, but spatial area at chip edges is insufficient as qubit count increases
Solution Approach 1:
The patent transitions from two-dimensional lateral wirebonding to three-dimensional vertical interposer connections. The interposer is positioned beneath the substrate, routing connections vertically through via holes rather than laterally along the chip edge, thereby eliminating the spatial constraint at chip edges while maintaining connection reliability
2Ease of operation
If waveguides are routed to chip edges, then signal transmission is achieved, but on-chip routing complexity increases with quadratic scaling of chip elements
Solution Approach 1:
The patent replaces complex two-dimensional on-chip waveguide routing with simplified vertical routing through the interposer. Waveguides are routed vertically through via holes in the interposer rather than laterally across the chip surface, dramatically reducing routing complexity while maintaining signal transmission capability
Solution Approach 2:
The interposer acts as an intermediary structure between the substrate and the external world. It provides a dedicated routing layer with via holes that mediate the connection between on-chip waveguides and external waveguides, simplifying the routing architecture by separating signal transmission functions from the computational qubit layer
3Productivity
If more qubits are integrated on a single chip, then computational power increases, but chip yield decreases due to increased fragility and decoherence
Solution Approach 1:
The patent segments the quantum computing system into modular components: the substrate containing qubits, the interposer for routing, and external waveguides for I/O. This segmentation allows independent optimization and testing of each component, improving overall chip yield by reducing the complexity of monolithic integration while maintaining high computational power through modular scaling
Data Source
AI summary
Discloses is a quantum computing apparatus (30) comprising a patterned layer which comprises an electrically conductive material and forms multiple qubits (34), adjacent and parallel to a substrate layer, such that the substrate layer and the patterned layer form a layer stack (31). The quantum computing apparatus further comprises an interposer comprising a rigid connection element (37) mechanically connected to the layer stack, wherein the connection element is substantially planar and positioned in a plane that is non-parallel to the plane in which the substrate layer is formed, and wherein the connection element comprises a conductive element (38), preferably a transmission line, formed on or in the connection element for providing an electrical connection to the patterned layer.