Superconducting Qubit Package Substrate Material Matching
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Solution Overview
Problem
Current quantum computing technologies face challenges in protecting superconducting qubits from decoherence, which limits their ability to maintain information-holding states long enough for calculations and readout results, due to the fragility of quantum states and the need for improved physical systems that can manipulate and read quantum mechanical phenomena.
Innovation Solution
The development of superconducting qubit device packages that include a die with superconducting qubits and resonators coupled to a package substrate using conductive pathways and interconnects, where the substrate and die share the same material to minimize thermal expansion differences and reduce electromagnetic interference, and the use of voided dielectric layers in the metallization stack to minimize losses and decoherence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If superconducting qubits are implemented in a device package, then quantum computations can be performed, but the qubits are susceptible to decoherence and electromagnetic interference
Solution Approach 1:
The patent creates an electromagnetic shielding environment by enclosing the superconducting qubits in a package substrate with controlled access points. The package substrate acts as an inert barrier that isolates the qubits from external electromagnetic interference while allowing necessary signal transmission through controlled coupling mechanisms.
Solution Approach 2:
The patent introduces intermediary elements such as coupling capacitors and transmission line structures that mediate between the qubits and the external environment. These intermediaries allow controlled interaction while filtering out harmful electromagnetic interference, protecting the qubit coherence.
2Ease of manufacture
If different materials are used for the substrate and die, then manufacturing flexibility is improved, but thermal expansion differences cause mechanical stress
Solution Approach 1:
The patent carefully selects and matches material parameters, particularly thermal expansion coefficients, between the substrate and die. By controlling these material parameters to be compatible, the patent eliminates thermal stress while maintaining the ability to manufacture with standard semiconductor materials.
3Reliability
If complete metallization stacks are used in the package substrate, then electrical connectivity is improved, but losses and decoherence increase
Solution Approach 1:
The patent extracts or removes portions of the metallization stack in areas where they would cause excessive losses. By selectively eliminating unnecessary metal layers and conductive structures near the qubits, the patent reduces electromagnetic losses and decoherence while maintaining essential electrical connectivity through optimized signal paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the mechanical and electrical integrity of superconducting qubit devices, improves signal integrity, and extends the coherence times of qubits by reducing thermal stress and electromagnetic interference, enabling more reliable quantum computations.
Implementation Method 1
a quantum device including a plurality of superconducting qubits disposed on the first face of the die, a plurality of resonators disposed on the first face of the die
Implementation Method 2
conductive pathways coupled between conductive contacts at the first face of the die and associated ones of the plurality of superconducting qubits or associated ones of the plurality of resonators
Data Source
AI summary
One superconducting qubit device package disclosed herein includes a die having a first face and an opposing second face, and a package substrate having a first face and an opposing second face. The die includes a quantum device including a plurality of superconducting qubits and a plurality of resonators on the first face of the die, and a plurality of conductive pathways coupled between conductive contacts at the first face of the die and associated ones of the plurality of superconducting qubits or of the plurality of resonators. The second face of the package substrate also includes conductive contacts. The device package further includes first level interconnects disposed between the first face of the die and the second face of the package substrate, coupling the conductive contacts at the first face of the die with associated conductive contacts at the second face of the package substrate.