Integrated Qubit Readout Board for Cryogenic Thermalization

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Solution Overview

Problem

Conventional prototype hardware for circulators, directional couplers, and termination resistors in superconducting quantum systems is not suitable for large-scale quantum computing due to space constraints and inefficient thermalization within cryostats, leading to noise and decoherence issues in qubit performance.

Innovation Solution

An integrated circuit board design that mounts Josephson junction parametric amplifiers, circulators, and 50 Ohm terminators directly, with multiple conducting layers for efficient thermalization and compact integration, using high thermal conductivity materials like copper and aluminum, and a magnetic shield to minimize magnetic interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional prototype hardware for circulators, directional couplers, and termination resistors is used, then device functionality is achieved, but space constraints and inefficient thermalization occur leading to noise and decoherence

Engineering Contradiction:
Improvequbit coherenceVSAvoidspace utilization in cryostat
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent integrates circulators, directional couplers, termination resistors, and parametric amplifiers onto a single circuit board assembly, consolidating multiple discrete components into one unified structure that fits within the cryostat while maintaining all necessary functions

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuit board serves multiple functions simultaneously: it provides mechanical support for all components, establishes thermal pathways for heat dissipation, provides electrical interconnections, and enables magnetic shielding, replacing the need for separate structures for each function

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If conventional prototype hardware is used, then device functionality is achieved, but inefficient thermalization occurs causing heat dissipation issues

Engineering Contradiction:
Improvethermalization efficiencyVSAvoidheat dissipation
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The circuit board acts as a thermal intermediary with high thermal conductivity material connecting the termination resistors and circulators to the cold stage of the cryostat, efficiently conducting heat away from the components

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses materials with high thermal conductivity specifically at the locations where heat dissipation is most critical, such as the circuit board substrate and mounting structures for termination resistors, ensuring efficient heat removal from hot spots

Inventive Principle:
Principle #3Local quality

3Reliability

If integrated circuit board design is implemented, then thermalization and noise reduction are enhanced, but device complexity increases

Engineering Contradiction:
Improvesignal fidelityVSAvoidintegration complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The readout system is divided into modular functional blocks (circulator sections, amplification sections, termination sections) that can be independently designed and assembled on the circuit board, reducing the complexity of the overall integration process

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated circuit board design enhances thermalization and reduces noise, allowing for high-fidelity state measurements of superconducting qubits with improved coherence and reduced signal loss, enabling more efficient operation of large-scale quantum computing systems.

Implementation Method 1

the circulator comprises a termination port electrically connected to a termination resistor arranged to terminate a pump tone received by the superconducting parametric amplifier

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 2

the front plane layer, the second signal layer and the back plane layer comprise a second conductor whose thermal conductivity is larger than 300 W/m/K at 10 mK temperature

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the integrated qubit readout circuit further comprises a magnetic shield disposed around the superconducting parametric amplifier, arranged to shield the superconducting parametric amplifier from magnetic fields of the circulator

Methodology Applied
Scientific EffectMagnetic shielding: Magnetic Field

Data Source

PatentUS12193339B1Integrated readout card
Publication Date: 2025.01.07 GOOGLE LLC
  • US12193339B1 patent drawing
  • US12193339B1 patent drawing
  • US12193339B1 patent drawing

AI summary

An integrated qubit readout circuit is presented, which includes a superconducting parametric amplifier, a circuit board arranged to mount the superconducting parametric amplifier, a circulator mounted on the circuit board and connected to the superconducting parametric amplifier, wherein the circulator comprises a termination port electrically connected to a termination resistor arranged to terminate a pump tone received by the superconducting parametric amplifier, and wherein the termination resistor is mounted on the circuit board.