Qubit Signal Transmission via Inductive Coupling
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Solution Overview
Problem
Current qubit technologies require signal transmission from room temperature to cryogenic environments, which leads to thermal energy conduction, increasing error rates and reducing signal quality due to direct thermal conduction paths.
Innovation Solution
A signal transmission device utilizing near-field coupling through mutual induction between two sensing circuit boards to transmit signals without direct thermal conduction paths, employing a transceiver circuit, first and second sensing circuit boards, and a thermal insulation shell to maintain cryogenic environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transmission lines are used to transmit signals from room temperature to cryogenic environment, then signal transmission is achieved, but thermal energy conduction increases causing error rate increase and signal quality degradation
Solution Approach 1:
The patent introduces a thermal insulation shell as an intermediary component between the room temperature control equipment and the cryogenic qubit environment. This shell acts as a thermal barrier that blocks heat conduction while allowing signal transmission through the walls, thus protecting the qubit from thermal interference without compromising signal transmission capability
Solution Approach 2:
The patent replaces direct physical contact transmission (mechanical/electrical connection through transmission lines) with electromagnetic field-based near-field coupling transmission. This substitution eliminates the need for physical transmission lines that conduct heat, using instead electromagnetic induction through the thermal insulation shell walls to transmit signals without thermal conduction
2Ease of operation
If transmission lines conduct signals through thermal insulation barrier, then signal transmission is enabled, but thermal insulation effectiveness is reduced due to power consumption and heat generation
Solution Approach 1:
The thermal insulation shell serves as a mediator that separates the thermal domains while enabling electromagnetic coupling. The shell walls allow magnetic field penetration for signal transmission while maintaining thermal isolation, thus preserving temperature differential and insulation effectiveness
Solution Approach 2:
The patent changes the transmission mechanism from direct electrical conduction through transmission lines to magnetic coupling through the shell walls. This parameter change in transmission mode eliminates the heat generation associated with resistive losses in transmission lines, preserving thermal insulation effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces thermal conduction paths, minimizing disruption to the cryogenic environment and maintaining qubit operational quality by using near-field coupling for signal transmission.
Implementation Method 1
The first sensing circuit board and the second sensing circuit board perform mutual induction to produce energy changes, and the transceiver circuit transmits and receives a signal with the qubit through the mutual induction between the first sensing circuit board and the second sensing circuit board
Implementation Method 2
The thermal insulation shell is used to separate a thermal insulation area. The second sensing circuit board and the qubit are located in the thermal insulation area of the thermal insulation shell
Data Source
AI summary
Disclosed are a signal transmission device and a quantum computer system for a qubit. The signal transmission device includes a transceiver circuit, a first sensing circuit board, a thermal insulation shell and a second sensing circuit board. The first sensing circuit board is coupled to the transceiver circuit. The thermal insulation shell separates a thermal insulation area. The second sensing circuit board is coupled to the qubit. The second sensing circuit board and the qubit are located in the thermal insulation area of the thermal insulation shell. The transceiver circuit is located outside the thermal insulation area of the thermal insulation shell. The first sensing circuit board and the second sensing circuit board perform mutual induction to produce energy changes, and the transceiver circuit transmits and receives a signal with the qubit through the mutual induction between the first sensing circuit board and the second sensing circuit board.