Qudit Track Shuttling Layout for Dense Quantum Interactions

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Solution Overview

Problem

The increasing density and number of qubits in quantum computing arrays lead to challenges in classical wiring, heat dissipation, and crosstalk, reducing qubit density and requiring complex 3D architectures that are costly to produce.

Innovation Solution

A method for quantum computation using synchronized cyclic shuttling of qudits in separate pre-defined tracks within a quantum interaction distance, enabling interactions between pairs of qudits while maintaining high density and reducing crosstalk, and a quasi-3D architecture using a 2D layout.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If qubits are spaced out to reduce crosstalk, then crosstalk is reduced, but qubit density decreases

Engineering Contradiction:
ImprovecrosstalkVSAvoidqubit density
Core Design Contradiction:
Object-affected harmful factorsVSQuantity of substance

Solution Approach 1:

The patent transitions from a 2D planar arrangement to a 3D vertical stacking architecture. Qubits are arranged in multiple layers stacked vertically, allowing high density while maintaining spatial separation. The vertical dimension provides additional space for routing classical control lines without increasing lateral density, resolving the contradiction between reducing crosstalk and maintaining high qubit density.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The quantum processor is segmented into multiple functional layers: quantum dot layers for qubit storage, manipulation layers with control lines, and readout layers. Each layer performs specific functions and is vertically stacked. This segmentation allows qubits to be densely packed in the vertical direction while maintaining adequate spacing within each layer to reduce crosstalk.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If the number of classical control lines increases to address more qubits, then addressing capability improves, but wiring complexity and heat dissipation problems worsen

Engineering Contradiction:
Improveaddressing capabilityVSAvoidwiring complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Classical control lines are routed in the vertical dimension through through-silicon vias (TSVs) and interlayer connectors rather than spreading laterally across the chip. This vertical routing consolidates wiring in the depth direction, reducing lateral wiring complexity while maintaining the ability to address all qubits in the dense 2D array.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements shared control mechanisms where groups of qubits are controlled by common control lines through collective addressing schemes. Multiple qubits can be addressed and manipulated using the same control infrastructure, reducing the total number of control lines required while maintaining full addressing capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Quantity of substance

If qubits are arranged in a close-packed array to increase density, then qubit density improves, but crosstalk increases

Engineering Contradiction:
Improvequbit densityVSAvoidcrosstalk
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

Qubits are arranged in a dense 2D grid within each layer but separated vertically into distinct layers. The vertical separation distance between layers is designed to be greater than the interaction range, preventing crosstalk while achieving high overall density through the stacking of multiple layers. This effectively uses the third dimension to resolve the density-crosstalk tradeoff.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Dielectric layers and isolation structures are introduced between adjacent quantum dot layers to act as intermediaries that block unwanted quantum interactions. These intermediary layers provide electrical isolation and prevent tunneling between layers, enabling dense packing while eliminating crosstalk.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP4490672B1A qudit processing method
Publication Date: 2026.03.18 QUANTUM MOTION TECH LTD
  • EP4490672B1 patent drawingFigure 1
  • EP4490672B1 patent drawingFigure 2
  • EP4490672B1 patent drawingFigure 3A~3B

AI summary

A method for performing quantum computations in a qudit processor. The qudit processor comprises a plurality of tracks, each comprising first, second and third locations. The method comprises: receiving qudits at manipulation devices inrespective tracks; manipulating the state of the qudits; transferring each qudit from the manipulation device to the first location in each track; enabling interaction between the first and second qudits; transferring each qudit from the first to second location; enabling interaction between the first and third qudits; transferring each qudit from the second to third location; and enabling interaction between the first and fourth qudits. The method further comprises either: transferring each qudit from the third to first location; and enabling interaction between the first and second qudits; or: transferring each qudit from the third location to the manipulation device in their respective tracks; and manipulating the state of each qudit.