Quick Disconnect Liquid Cooling for High-Density Processors
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Solution Overview
Problem
As computing platform components increase in size, density, power consumption, and clock speed, conventional heat dissipation methods such as heat sinks and fans become inadequate in managing heat effectively.
Innovation Solution
A cooling system comprising a cooling device coupled to the computing platform via hoses, using a coolant like water or ethylene glycol mixtures, which can include a pump to circulate the coolant and is integrated with quick-disconnect connectors on daughter cards to efficiently dissipate heat from components like GPUs and CPUs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks and fans are used for cooling, then the structure is simple and easy to implement, but the heat dissipation effectiveness is insufficient for high-power components
Solution Approach 1:
The cooling system is divided into modular components including quick disconnect connectors, coolant distribution manifolds, and individual heat sink modules that can be independently installed and removed. This segmentation allows the system to provide advanced liquid cooling capabilities while maintaining ease of maintenance and component replacement.
Solution Approach 2:
The cooling system incorporates quick disconnect mechanisms that enable dynamic reconfiguration of cooling components. Users can quickly connect or disconnect coolant lines and heat sink modules without tools, allowing the system to adapt to different thermal requirements and facilitating easy maintenance of high-performance cooling components.
2Productivity
If computing platform components increase in size, density, power consumption, and clock speed, then performance is improved, but heat dissipation issues become more problematic
Solution Approach 1:
The system employs liquid coolant circulation through quick disconnect connectors and coolant distribution manifolds to provide efficient heat removal from high-power components. This hydraulic cooling approach delivers superior heat dissipation capability compared to conventional air cooling, enabling sustained high-performance operation of dense computing components.
Solution Approach 2:
The cooling system provides targeted thermal management at specific hot spots on the computing platform. Quick disconnect connectors are positioned to deliver coolant directly to areas of highest thermal density, such as GPU and CPU regions, allowing optimized cooling where it is most needed while maintaining overall system performance.
3Ease of operation
If quick disconnect connectors are used for coolant delivery, then ease of maintenance and component replacement is improved, but risk of coolant leakage is increased
Solution Approach 1:
The quick disconnect connectors incorporate integrated sealing mechanisms and alignment features that prevent misconnection and leakage before operation begins. The design includes built-in compression seals and positioning structures that ensure proper engagement, cushioning against potential leakage risks while maintaining ease of connection and disconnection for maintenance purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively manages heat dissipation across computing platform components, enhancing performance and reliability by providing a more efficient cooling mechanism compared to conventional methods.
Implementation Method 1
A coolant may be provided to a first quick-disconnect connector extending through a bracket attached to a computing platform chassis. The coolant may be passed through the first quick-disconnect connector to a heat sink that may be thermally connected to a processing device
Implementation Method 2
A cooling system comprising a cooling device coupled to the computing platform via hoses, using a coolant like water or ethylene glycol mixtures, which can include a pump to circulate the coolant
Data Source
AI summary
Embodiments for providing cooling for computing platform components are disclosed. In one example embodiment, a coolant may be provided from connector extending through a bracket to heat dissipation device thermally coupled to a processor mounted on a printed circuit board, wherein the printed circuit board and the bracket comprise a daughter card to be inserted into a connector on a motherboard of the computing platform.