Quilt Packaging System Edge Interconnects for Heterogeneous Chip Integration
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Solution Overview
Problem
High-performance integrated systems face challenges in achieving reduced power dissipation, high signal integrity, high bandwidth, low latency, and cost-effectiveness while integrating heterogeneous components fabricated using different processes and materials, and require innovative packaging solutions to overcome limitations in current interconnect technologies.
Innovation Solution
The quilt packaging system utilizes edge interconnect nodules on microchips to form direct electrical connections between adjacent chips, eliminating the need for traditional packaging methods and allowing for heterogeneous integration of disparate semiconductor technologies, thereby reducing power consumption and enhancing signal integrity and bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional packaging methods with pin drivers and package capacitances are used, then electrical connections between chips are established, but power dissipation increases and signal integrity deteriorates
Solution Approach 1:
The patent extracts and eliminates the package capacitances and pin drivers from the interchip communication path by using direct edge-to-edge coupling between microchips. This removes the harmful capacitive effects that cause signal integrity deterioration and reduce power efficiency, while maintaining electrical connectivity through direct nodal contacts.
Solution Approach 2:
The patent introduces an intermediate coupling field (electromagnetic field) that directly couples the output nodule of one microchip to the input nodule of another microchip, eliminating the need for traditional package-level electrical connections. This intermediary field coupling enables direct communication without the parasitic effects of package capacitances.
2Adaptability or versatility
If heterogeneous ICs and components fabricated using different processes and material systems are integrated, then functionality and performance are improved, but manufacturing complexity increases
Solution Approach 1:
The patent creates a universal interconnection interface (edge nodules) that can accommodate different microchip technologies, fabrication processes, and material systems. The standardized edge coupling mechanism works universally across heterogeneous devices, enabling bipolar, CMOS, and other IC technologies to be integrated without requiring technology-specific packaging solutions.
Solution Approach 2:
The patent segments the integrated system into independent microchip modules that can be fabricated using different processes and materials, then assembled through edge coupling. This segmentation allows each module to be optimized for its specific function and fabrication process while maintaining ease of assembly through the standardized interconnection interface.
3Reliability
If conventional packaging structures with bond pads and ESD protection circuits are used, then device reliability is maintained, but chip area and manufacturing cost increase
Solution Approach 1:
The patent extracts and eliminates bond pads, ESD protection circuits, and other conventional packaging structures from the microchip design by using direct edge-to-edge coupling. The interconnect nodules are integrated directly into the active circuitry at the chip edges, removing the need for separate bonding interfaces and protection circuits that consume valuable chip area.
4Loss of energy
If direct edge-to-edge coupling between microchips is implemented, then power dissipation is reduced and signal integrity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs asymmetric interconnect nodule designs where output nodules and input nodules have complementary geometries that facilitate self-alignment during assembly. The asymmetric shapes provide mechanical guidance and tolerance compensation, reducing the stringency of manufacturing precision requirements while maintaining effective electrical coupling.
Data Source
AI summary
The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.