Quinone Etchant for Fast, Smooth Molybdenum Semiconductor Etching
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Solution Overview
Problem
Existing etchants for molybdenum-containing substances fail to achieve both a high etching rate and effective suppression of surface roughness during the etching process.
Innovation Solution
An etchant comprising a quinone compound with a quinone structure and a solvent, specifically formulated with a quinone compound content of 0.0001% to 10.0% by mass, and a solvent that includes water and a water-soluble organic solvent, is used to etch molybdenum-containing substances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional etchants are used to increase etching rate, then productivity is improved, but surface roughness increases and manufacturing precision deteriorates
Solution Approach 1:
The patent applies parameter changes by carefully controlling the concentration of hydrogen peroxide (0.01-5% by mass) and the dissolved oxygen amount (3-50 mg/L) in the etchant. By adjusting these chemical parameters within specific ranges, the etchant achieves optimal balance between etching rate and surface roughness control, resolving the contradiction between productivity and manufacturing precision
Solution Approach 2:
The etchant employs a composite chemical formulation containing hydrogen peroxide, acidic substance, amine compound, hydrogen peroxide decomposition inhibitor, and molybdenum erosion promoting ions. This composite composition works synergistically to achieve both high etching rate and smooth surface finish, simultaneously improving productivity while maintaining manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The etchant provides an excellent etching rate while effectively suppressing surface roughness of molybdenum-containing substances, ensuring high precision in semiconductor manufacturing.
Implementation Method 1
an etchant used for a molybdenum-containing substance, comprising: a quinone compound having a quinone structure; and a solvent
Data Source
AI summary
An object is to provide an etchant which has an excellent etching rate and can suppress roughness of a surface of a molybdenum-containing substance after an etching treatment. The etchant of the present invention is an etchant used for a molybdenum-containing substance, the etchant containing a quinone compound having a quinone structure and a solvent.