External Rack Chimney Assembly for Heat Extraction Without Added Depth
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing data center rack designs face limitations in maximizing capacity due to the need for thickened panels with fans to dissipate heat, which increases the depth of the racks and reduces the number of racks that can be fitted in a data center.
Innovation Solution
A rack cooling system that maintains the depth of the rack to a minimum by using a back panel with an open area proximate the top and an air passageway to conduct heated air away from the housing, potentially combined with a chimney system for enhanced airflow, allowing for efficient heat extraction without increasing the rack's depth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thickened panels with fans are used to dissipate heat, then heat dissipation capability is improved, but rack depth increases
Solution Approach 1:
The invention extracts the heat dissipation function from the traditional thick rear panel location and relocates it to the top of the rack. By positioning the exhaust fan and outlet at the top, the system achieves effective heat removal without requiring increased rack depth, thus resolving the contradiction between heat dissipation capability and rack depth.
Solution Approach 2:
The invention changes the spatial dimension of heat dissipation from the traditional rear-panel approach (horizontal dimension) to a top-of-rack approach (vertical dimension). This dimensional shift allows the exhaust fan to draw hot air upward and out of the rack, achieving effective cooling without increasing the rack's depth while still maintaining proper airflow patterns.
2Ease of operation
If thickened panels are used to route air through the rack, then air circulation is improved, but the number of racks that can be fit into a data center decreases
Solution Approach 1:
The invention extracts the air circulation function from the thickened rear panel design and relocates it to the top of the rack. By positioning the exhaust fan and outlet at the top, the system achieves effective air circulation without requiring increased rack depth, thereby maximizing the number of racks that can be accommodated in a given data center space.
Solution Approach 2:
The invention shifts the air circulation approach from horizontal airflow management (requiring deep rear panels) to vertical airflow management (using top-mounted exhaust). This dimensional change enables effective cooling while minimizing rack depth, thus increasing overall data center rack capacity.
3Temperature
If deep rear doors with internal fans are used, then heat extraction is improved, but rack depth increases
Solution Approach 1:
The invention extracts the heat extraction function from the deep rear door configuration and relocates it to the top of the rack. By positioning the exhaust fan and outlet at the top, the system achieves superior heat extraction efficiency without requiring increased rack depth, as hot air naturally rises and can be efficiently removed from the top location.
Solution Approach 2:
The invention transitions from horizontal heat extraction (rear door approach) to vertical heat extraction (top outlet approach). This dimensional change leverages natural convection currents where hot air rises, allowing the exhaust fan to efficiently remove heat from the top of the rack without requiring deep rear doors, thus maintaining compact rack depth while improving heat extraction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables maximum data center rack capacity by maintaining the rack's depth while effectively dissipating heat, allowing for more racks to be accommodated without the need for deep rear doors and internal fans, thus optimizing airflow and reducing the space required for air-handling equipment.
Implementation Method 1
an air passageway in fluid communication with the open area in the back, to conduct heated air exiting the housing through the open area away from the housing
Implementation Method 2
heated air exiting the housing
Implementation Method 3
The assembly may further comprise an air-moving device in fluid communication with the air passageway
Data Source
AI summary
An assembly for extracting heat from a housing for electronic equipment the housing having an essentially solid top portion and an essentially solid back portion. The assembly includes a first opening in the top portion of the housing, the first opening located at the back of the top portion, proximate the back portion of the housing, a second opening in the back portion of the housing, the second opening located at the top of the back portion, proximate the top portion of the housing, wherein the first opening is contiguous with the second opening, and a chimney external to the housing and coupled to the housing. The chimney encompasses and is in fluid communication with the first and second openings.