Rack Liquid Cooling Control for Balanced Coolant Temperature

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Solution Overview

Problem

Conventional liquid cooling techniques for datacenter rack-mounted processing assemblies lack effective control and balance of cooling liquid and heated liquid temperatures, leading to inefficiencies in heat dissipation and potential component failures.

Innovation Solution

A fluid cooling system with smart control valves and fans that adjust flow rates and speeds based on temperature differentials and internal component temperatures to maintain optimal cooling efficiency, incorporating a leakage detection system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional liquid cooling techniques are used without dynamic control, then the cooling system structure is simple, but the temperature control precision and cooling efficiency are insufficient

Engineering Contradiction:

Improvecooling liquid temperature controlVSAvoidcooling system structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent implements dynamic control of cooling liquid flow rate through smart control valves that automatically adjust based on real-time temperature differentials. The system transitions from static to dynamic operation, allowing the cooling system to adapt to varying thermal loads and maintain optimal temperature control precision.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system incorporates temperature sensors and control algorithms that continuously monitor temperature differentials between inlet and outlet cooling liquid. This feedback mechanism enables automatic adjustment of flow rates to maintain target differential temperature values, resolving the contradiction between simple structure and precise temperature control.

Inventive Principle:

Principle #23Feedback

2Productivity

If liquid flow rate is increased to improve heat dissipation, then cooling efficiency improves, but energy consumption increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidpump energy consumption

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

The system dynamically changes the flow rate parameter based on actual cooling needs. By adjusting the flow rate to match the target differential temperature rather than maintaining constant high flow, the system achieves optimal heat dissipation efficiency while minimizing pump energy consumption.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The control system ensures continuous monitoring and adjustment of flow rates to maintain optimal cooling efficiency. The smart valves continuously modulate flow to match thermal demands, ensuring useful cooling action is maintained without excessive energy consumption during low-load conditions.

Inventive Principle:

Principle #20Continuity of useful action

3Stability of the object's composition

If multiple cooling zones are implemented to improve temperature distribution, then temperature uniformity improves, but system complexity increases

Engineering Contradiction:

Improvetemperature distribution uniformityVSAvoidcooling circuit arrangement

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent implements individual smart control valves for different cooling zones or racks, allowing localized temperature control. Each zone can independently adjust its flow rate based on local temperature differentials, achieving uniform temperature distribution across the datacenter while managing complexity through modular zone-based control.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system ensures reliable temperature control and efficient heat dissipation by dynamically adjusting liquid and air flow rates and speeds, preventing component overheating and improving overall cooling system performance.

Implementation Method 1

the at least one liquid cooling block being arranged to be in respective thermal contact with the at least one heat-generating electronic processing element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the received cooling liquid absorbs the generated heat and the heated liquid is circulated

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

the liquid distribution circuit comprising at least one heat exchanger (ALHEX) configured to cool an air flow of the rack with the cooling liquid

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 4

at least one electronic processing element is being air-cooled by at least one fan

Methodology Applied

Scientific EffectForced convection: Forced Convection

Data Source

PatentUS20260040505A1Intelligent temperature control and balance of datacenter fluid cooling arrangement

Publication Date: 2026.02.05 OVH

AI summary

The invention relates to a fluid cooling method for rack-mounted processing assemblies, comprising measuring internal temperatures of said at least one air cooled electronic processing element and, when internal temperatures of rack-mounted processing assembly are less than a predetermined limit, and, determining whether at the current input cooling liquid temperature, internal temperatures of said at least one air cooled electronic processing element are less than a predetermined limit.