Rack Cooling Heat Pipes for Varying Electronic Circuit Loads
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Solution Overview
Problem
Conventional cooling devices for rack-type electronic equipment face challenges in efficiently managing varying heat quantities generated by different electronic circuit devices, as they require customized designs for each configuration, making it difficult to effectively cool devices with different heating loads.
Innovation Solution
The cooling device employs multiple heat pipes with an evaporator and condenser section connected by drainage and steam tubes, allowing for independent cooling of electronic circuit devices with different heating quantities, using refrigerant vaporization and condensation to manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single integrated cooling device is designed to match specific circuit board configurations, then cooling effectiveness for that configuration is improved, but device complexity and manufacturing cost increase due to customization requirements
Solution Approach 1:
The cooling device is divided into multiple independent heat pipes, each capable of cooling separate circuit board groups. This segmentation allows the system to handle different heat quantities from different circuit boards without requiring a completely customized integrated design, thus reducing device complexity while maintaining cooling effectiveness.
Solution Approach 2:
The heat pipes are designed with universal applicability to different circuit board configurations. The same heat pipe structure can be used across multiple groups of circuit boards with varying heat generation levels, eliminating the need for custom-designed cooling devices for each configuration and reducing overall device complexity.
2Reliability
If heat pipe is designed to fill gaps between circuit boards, then cooling coverage is improved, but adaptability to different circuit board quantities and layouts is reduced
Solution Approach 1:
The cooling system uses multiple independent heat pipes that can be selectively installed in different positions and quantities according to the specific circuit board layout. Each heat pipe operates independently, allowing the system to adapt to various circuit board configurations while maintaining comprehensive cooling coverage where heat pipes are installed.
Solution Approach 2:
The cooling device allows for dynamic configuration of heat pipes based on actual cooling needs. The system can be adjusted to accommodate different numbers of circuit boards and their respective heat generation levels by selectively activating or positioning heat pipes, thereby achieving both good cooling coverage and high adaptability.
3Device complexity
If a single cooling cycle is used for the entire rack, then system simplicity is maintained, but the ability to handle different heat quantities from individual circuit boards is compromised
Solution Approach 1:
The cooling system segments the single rack-wide cooling cycle into multiple independent heat pipe cycles, each capable of handling heat from specific circuit board groups. This allows different heat quantities from individual circuit boards to be managed independently while maintaining overall system simplicity through the modular heat pipe structure.
Solution Approach 2:
Each heat pipe provides localized cooling tailored to the specific heat generation needs of its associated circuit board group. This local quality approach allows the system to handle different heat quantities from different circuit boards effectively, while the overall system remains relatively simple through the use of standardized heat pipe modules.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient cooling of electronic circuit devices with varying heat loads, reducing the load on air conditioning systems and allowing for energy-efficient temperature control, while also simplifying installation and maintenance through flexible hose connections and adaptable door designs.
Implementation Method 1
Liquid refrigerant in the evaporator is vaporized by heat generated from the electronic circuit devices
Implementation Method 2
Vaporized refrigerant by heat absorption travels upward through heat pipe 103
Implementation Method 3
The vaporized refrigerant is condensed to liquid by heat exchange with cold outdoor air sucked by air blower 107 in heat exchanger 104
Implementation Method 4
The vaporized refrigerant is condensed to liquid by heat exchange with cold outdoor air
Implementation Method 5
heat pipe 103 is disposed to fill a gap between each one of the groups of circuit boards 102
Implementation Method 6
Vaporized refrigerant by heat absorption travels upward through heat pipe 103 and moves into heat exchanger 104
Data Source
AI summary
The present invention provides a cooling device for rack-type electronic equipment. The rack-type electronic equipment is provided with electronic circuit devices having different heating quantities inside an enclosure, and the cooling device has multiple heat pipes for cooling the rack-type electronic equipment. A condenser unit is provided on the upper surface of the enclosure, an evaporator is provided on the back surface of the enclosure, and each electronic circuit device having a different heating quantity is cooled by means of the heat pipes.