Rack Cooling Arrangement with Relief-Line Flow Management
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Solution Overview
Problem
Existing cooling systems for server racks require significant infrastructure and labor costs due to the combination of liquid and air cooling, which is inefficient and costly to implement in large computing facilities.
Innovation Solution
A cooling arrangement for server racks that incorporates a first loop with liquid cooling units and a secondary loop with air-to-liquid heat exchangers, connected by a liquid-to-liquid heat exchanger, with a relief line that adjusts based on operational parameters to manage pressure and temperature, reducing the need for external piping and infrastructure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If both liquid cooling and air cooling are provided to each rack, then cooling effectiveness is improved, but infrastructure complexity and costs increase significantly
Solution Approach 1:
The patent combines liquid cooling and air cooling systems into a single integrated rack cooling arrangement. The liquid cooling units are thermally coupled to heat-generating components while air-to-liquid heat exchangers are integrated within the rack structure, allowing both cooling mechanisms to work together in a unified system rather than as separate installations.
Solution Approach 2:
The cooling arrangement performs multiple functions within a single system: liquid cooling units provide direct cooling to specific heat-generating components, while air-to-liquid heat exchangers cool the overall rack environment and discharge air. This multi-functional integration eliminates the need for separate cooling infrastructures.
2Temperature
If both liquid cooling and air cooling are provided to each rack, then cooling effectiveness is improved, but material and labor costs increase
Solution Approach 1:
By merging liquid and air cooling into a single integrated system, the patent reduces the total amount of infrastructure materials needed compared to installing two separate cooling systems. The shared pump, relief line, and heat exchanger components reduce material costs and simplify installation labor.
3Reliability
If a relief line is added to connect first and second loops, then pressure and temperature management is improved, but system complexity increases
Solution Approach 1:
The relief line acts as an intermediary component that selectively connects the first and second loops based on operational conditions. It mediates between the liquid cooling loop and the air cooling loop, allowing pressure and temperature management without requiring complex control systems by using a simple thermostatic or pressure-actuated mechanism.
4Ease of manufacture
If external piping infrastructure is reduced, then installation costs are reduced, but cooling liquid flow management becomes more challenging
Solution Approach 1:
The patent nests the second loop (air-to-liquid heat exchangers) within the rack structure and connects it to the first loop (liquid cooling units) through an integrated liquid-to-liquid heat exchanger. This nesting arrangement minimizes external piping by embedding cooling components within the rack itself, reducing installation costs while maintaining effective cooling liquid flow management through compact internal routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes external piping and infrastructure costs while effectively managing cooling liquid flow, ensuring efficient temperature regulation and reducing the risk of overheating in electronic devices.
Implementation Method 1
at least one liquid cooling unit defining a liquid channel adapted to receive a cooling liquid for transferring heat from the heat-generating component to the cooling liquid flowing in the liquid channel
Implementation Method 2
a secondary side of the liquid-to-liquid heat exchanger, the secondary side being thermally coupled to the primary side to transfer heat from the primary side to the secondary side in response to a temperature of the primary side being greater than a temperature of the secondary side
Implementation Method 3
a pump fluidly connected between the primary side of the liquid-to-liquid heat exchanger and the at least one liquid cooling unit, the pump being adapted for causing the cooling liquid to flow within the first loop
Data Source
AI summary
A cooling arrangement for cooling of a rack hosting an electronic device includes a first loop including a liquid cooling unit thermally coupled to a heat-generating component of the electronic device, a primary side of a liquid-to-liquid heat exchanger fluidly connected to the liquid cooling unit; and a pump fluidly connected between the primary side and the liquid cooling unit. A second loop includes a secondary side of the liquid-to-liquid heat exchanger thermally coupled to the primary side for transfer of heat from the primary side to the secondary side. A relief line selectively fluidly connects the first and second loops and is operable in: (i) a closed state whereby the relief line does not allow cooling liquid flow therethrough, and (ii) an open state whereby the relief line fluidly connects the first and second loops.