Data Center Rack Cooling Assembly with Vertical Heat Exchanger

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Solution Overview

Problem

Existing data center rack cooling solutions often require specialized rack designs, are difficult to install, and occupy excessive space, making them inefficient and inconvenient for heat management.

Innovation Solution

A cooling assembly for data center racks featuring a chassis with vertically positioned heat exchangers, adjustable upper abutting assemblies for sealing, and sliding lower brackets that allow easy installation and adaptability to various rack sizes, promoting airflow and efficient heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a rear cooling assembly is provided on a rack, then heat management is improved, but the rack has to be especially designed to fit the cooling assembly and installation becomes difficult

Engineering Contradiction:
Improveheat managementVSAvoidinstallation ease
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The cooling assembly is designed as a separate, modular unit that can be independently installed on the rack without requiring custom rack modifications. The assembly includes a cooling device, support structure, and mounting brackets that can be detached and installed as a complete module, enabling easy installation while maintaining effective heat management.

Inventive Principle:
Principle #1Segmentation

2Temperature

If a rear cooling assembly is provided on a rack, then heat management is improved, but the cooling assembly takes up too much space behind the rack

Engineering Contradiction:
Improveheat managementVSAvoidspace occupation
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The cooling assembly utilizes the vertical dimension by positioning the cooling device above the rack level, with the support structure extending downward to engage with the rack's lower portion. This vertical arrangement allows the cooling assembly to be compact in the horizontal plane while maintaining sufficient cooling capacity, thereby reducing the space occupied behind the rack.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Strength

If the supporting wall thickness is increased, then structural strength is improved, but the device complexity and material usage increase

Engineering Contradiction:
Improvesupporting wall strengthVSAvoidstructural complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The supporting wall is designed with an optimized thickness of 2-5 mm that provides sufficient structural strength to support the cooling assembly and rack components while minimizing material usage and structural complexity. This parameter optimization balances the requirements for strength, compactness, and ease of manufacture.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient heat management by allowing easy installation and adaptability to different rack sizes, reducing space usage and improving airflow, thus effectively addressing the inefficiencies of prior cooling solutions.

Implementation Method 1

a cooling coil for circulating a cooling fluid therethrough

Methodology Applied
Scientific EffectHeat transfer: Heat Exchanger

Implementation Method 2

a plurality of fins connected to the cooling coil, the fins being spaced from one another to allow air flow therebetween

Methodology Applied
Scientific EffectAir flow: Convection

Data Source

PatentUS12150283B2Cooling assembly for a data center rack and method for assembling a rack system
Publication Date: 2024.11.19 OVH
  • US12150283B2 patent drawing
  • US12150283B2 patent drawing
  • US12150283B2 patent drawing

AI summary

A cooling assembly for a data center rack includes: a chassis; a heat exchanger connected to the chassis, the heat exchanger being disposed vertically at least in part between upper and lower ends of the chassis, and at least one lower bracket connected to a lower end portion of the chassis. The heat exchanger includes: a cooling coil for circulating a cooling fluid therethrough; and a plurality of fins connected to the cooling coil, the fins being spaced from one another to allow air flow therebetween. Each of the at least one lower bracket is a single piece of sheet metal bent into shape and includes a supporting wall extending frontward from the lower end portion of the chassis, the supporting wall being configured to receive at least in part a lower end of the data center rack thereon.