Data Center Rack Cooling via Cylindrical Interior Chamber
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Solution Overview
Problem
Traditional cooling systems for data center racks are inefficient, wasting space with 'hot aisles' and being unreliable, especially in managing temperature and humidity, which can lead to equipment damage and increased energy costs.
Innovation Solution
A cylindrical interior chamber within the data center racks that allows cool air to flow from all directions, heatsinks to absorb waste heat, and a spatially modulated airflow system to prevent positive pressure, combined with an integrated cooling system that includes fans, motors, and clutches for efficient airflow management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional cooling systems use hot aisles and standard airflow paths, then cooling coverage is provided, but space is wasted and cooling efficiency decreases
Solution Approach 1:
The patent inverts the traditional cooling approach by having cold air enter from the rear of racks and flow forward through equipment, rather than the conventional front-to-back flow. This reversal eliminates the need for hot aisles, reduces space requirements, and improves cooling efficiency by directly targeting heat-generating components
Solution Approach 2:
The patent introduces a vertical dimension to airflow by incorporating upper and lower plenums that distribute cold air horizontally across multiple rack levels. This multi-dimensional airflow approach maximizes cooling coverage while minimizing the horizontal space required for hot aisles
2Temperature
If cooling fluid is directed through racks from outer radius to interior chamber, then cooling coverage is improved, but pressure differential management becomes challenging
Solution Approach 1:
The patent uses an interior chamber as an intermediary space between the cold air inlet and the equipment to be cooled. This chamber acts as a pressure equalization zone that facilitates smooth airflow from the outer radius through racks without creating excessive pressure differentials, while still achieving comprehensive cooling coverage
Solution Approach 2:
The patent implements spatially modulated airflow restrictors at different radial positions within the interior chamber. These restrictors are locally adjusted to optimize airflow distribution, allowing cold air to penetrate effectively to the center while maintaining balanced pressure differentials across the entire rack array
3Ease of operation
If spatially modulated airflow restrictors are used to prevent positive pressure, then airflow distribution is improved, but device complexity increases
Solution Approach 1:
The patent uses spatially modulated airflow restrictors with varying opening sizes at different positions within the interior chamber. By changing the airflow resistance parameter locally rather than uniformly, the system achieves optimal airflow distribution and prevents positive pressure buildup without requiring complex active control mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances cooling efficiency, reduces space usage, and maintains optimal temperature and humidity levels, lowering energy consumption and extending equipment lifespan.
Implementation Method 1
directing a cooling fluid (e.g., air), at a first temperature and a first pressure from an outer radius of circularly arranged racks through the racks and components within the racks; passing the cooling fluid to an interior chamber of the datacenter chamber at a second temperature and a second pressure
Implementation Method 2
directing a cooling fluid (e.g., air), at a first temperature and a first pressure from an outer radius of circularly arranged racks through the racks and components within the racks; passing the cooling fluid to an interior chamber of the datacenter chamber at a second temperature and a second pressure
Data Source
AI summary
Provided is a process for cooling a datacenter chamber having racks configured to hold arrays of rack-mounted computing devices, the process including: directing a cooling fluid, at a first temperature and a first pressure from an outer radius of circularly arranged racks through the racks and components within the racks; passing the cooling fluid to an interior chamber of the datacenter chamber at a second temperature and a second pressure; and directing the cooling fluid upward to exit the interior chamber.


