Rack Heat Extraction Assembly Without Increased Rack Depth
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Solution Overview
Problem
Existing rack cooling systems for electronic equipment increase the depth of data center racks due to thickened panels with fans and ducting, limiting the number of racks that can be fitted in a data center.
Innovation Solution
A rack cooling system that maintains the rack depth minimal by using an open area at the back and top with an air passageway to extract heated air, potentially featuring an air-moving device and flexible or inflexible ducts, allowing heated air to be conducted away from the housing without the need for deep rear doors and internal fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thickened panels with fans and ducting are used to cool electronic equipment, then heat dissipation is improved, but rack depth increases
Solution Approach 1:
The invention extracts the air-moving function from the traditional thick rear door panel and relocates it to a separate, shallow air passageway system. The rear door panel is thinned significantly while an air passageway with its own air-moving device is positioned adjacent to the open area in the back, separating the cooling function from the structural panel.
Solution Approach 2:
The invention changes the spatial arrangement by positioning the air passageway and air-moving device in a location that extends from the back toward the front of the rack, but maintains a shallow profile. The air passageway is in fluid communication with the open area in the back and can extend out from the back at various angles, optimizing heat extraction without increasing rack depth.
2Productivity
If rack depth is minimized to maximize data center capacity, then space utilization is improved, but heat extraction efficiency may deteriorate
Solution Approach 1:
The invention introduces an intermediary air passageway system that mediates between the limited rack depth and the requirement for effective heat extraction. The air passageway acts as a conduit that connects the open area in the back to the external environment, allowing heated air to be conducted away efficiently even with minimal rack depth.
Solution Approach 2:
The cooling system is segmented into distinct functional components: an open area in the back for heat extraction, a separate air passageway for air conduction, and an air-moving device for airflow generation. This segmentation allows each component to be optimized independently for its specific function while maintaining overall system efficiency within the constrained rack depth.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient cooling of electronic equipment without increasing the rack depth, maximizing data center rack capacity by allowing for closer rack spacing and optimizing the use of top space for additional equipment.
Implementation Method 1
an air passageway in fluid communication with the open area in the back, to conduct heated air exiting the housing through the open area away from the housing
Implementation Method 2
heated air exiting the housing
Implementation Method 3
The assembly may further comprise an air-moving device in fluid communication with the air passageway
Data Source
AI summary
An assembly for extracting heat from a housing for electronic equipment, the housing having a front, a back, two sides and a top. The assembly is defined by a back for the housing that defines an open area proximate the top, and an air passageway in fluid communication with the open area in the back, to conduct heated air exiting the housing through the open area away from the housing.