Rack-Mount Cooling System with Thermoelectric Unit

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Rack-mount cases for electronics equipment face challenges in managing high temperatures during transportation and operation, especially in harsh environments, as existing solutions do not effectively maintain optimal temperature conditions within the cases.

Innovation Solution

A rack-mount case system incorporating a cooling unit with a heat sink, blower, manifold, and thermoelectric component, which secures to a slide-out frame, enables efficient air circulation and temperature regulation by exchanging air with the ambient environment through vent openings, ensuring the electronics equipment operates within a desired temperature range.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a rack-mount case is fully enclosed and sealed to protect electronics equipment from sand, dust, and chemical warfare agents, then protection against harmful environmental factors is improved, but heat dissipation deteriorates causing high temperatures during transportation and operation

Engineering Contradiction:
Improveprotection against sand, dust, and chemical warfare agentsVSAvoidtemperature inside the rack-mount case
Core Design Contradiction:
Object-affected harmful factorsVSTemperature

Solution Approach 1:

The case is segmented into separate sealed compartments (equipment bay and accessory storage) with dedicated ventilation paths. The equipment bay remains sealed for protection while having its own independent cooling system, allowing different environmental requirements for different zones

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A thermoelectric cooling unit acts as an intermediary between the sealed equipment compartment and the external environment. This device actively manages heat transfer, allowing the case to remain sealed for protection while the thermoelectric unit handles thermal regulation through controlled heat pump operation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If the rack-mount case is designed to be compact and space-efficient, then space utilization is improved, but cooling system integration becomes more difficult

Engineering Contradiction:
Improvespace occupied by the rack-mount caseVSAvoidcooling system integration
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The thermoelectric cooling unit is integrated directly into the case structure, merging the cooling function with the case housing. The unit fits within the case's internal volume and uses the case walls as mounting surfaces, eliminating the need for separate external cooling assemblies

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The cooling system components are nested within the case structure. The thermoelectric unit is positioned inside the equipment bay, using available internal space. Ventilation channels are nested within the case walls, allowing cooling functionality without increasing external dimensions

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively maintains the interior region of the rack-mount case within a desired temperature range, ensuring optimal operation of electronics equipment by efficiently drawing heat from the equipment and dissipating it, even in extreme ambient conditions.

Implementation Method 1

A thermoelectric unit is located between the heat sink and the manifold

Methodology Applied
Scientific EffectThermoelectric cooling: Peltier Effect

Implementation Method 2

at least the second blower is configured to move air at a desired flow rate within the case

Methodology Applied
Scientific EffectForced convection: Forced Convection

Implementation Method 3

at least one heat sink in fluid communication with a first blower

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

efficiently drawing heat from the equipment and dissipating it

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20100085709A1Cooling system for rack-mounted electronics equipment
Publication Date: 2010.04.08 BECKLIN HLDG
  • US20100085709A1 patent drawing
  • US20100085709A1 patent drawing
  • US20100085709A1 patent drawing

AI summary

A rack-mount case system for receiving, supporting and storing electronics equipment includes a slide-out frame closely received and shock mounted in a case. The system includes a cooling unit having at least one heat sink in fluid communication with a first blower and a manifold in fluid communication with a second blower. A thermoelectric unit is located between the heat sink and the manifold to provide a compact cooling unit that may be secured to a side of the slide-out frame with a bracket, for example.