Rack Power-Cooling Integration for Heat-Stressed Server Distribution
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Solution Overview
Problem
High-density servers requiring liquid cooling face challenges such as air-side heat losses, congestion in server racks, and compromised performance due to restricted airflow and heat-stressed power distribution circuitry.
Innovation Solution
A power distribution system that integrates liquid cooling and profile monitoring, featuring a power distribution sub-system and a liquid cooling sub-system thermally coupled within a common or separate housing, with controllers for load classification and alert generation based on diagnostic data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is implemented for high-density servers, then cooling effectiveness is improved, but air-side heat losses increase by 15-20% and rack congestion worsens
Solution Approach 1:
The patent combines the power distribution subsystem and liquid cooling subsystem into a single integrated rack power-cooling delivery device. The power distribution circuitry and liquid cooling manifolds are housed together in a common enclosure, allowing simultaneous delivery of both power and cooling to server components. This integration eliminates the need for separate air-based power distribution paths, thereby reducing air-side heat losses while maintaining effective cooling.
Solution Approach 2:
The integrated device serves multiple functions simultaneously: it distributes electrical power through outlets to connected loads, provides liquid cooling through manifolds with supply and return lines, and houses both subsystems in a unified structure. This multi-functionality allows the system to deliver both power and cooling through a single delivery mechanism, improving overall system efficiency and reducing energy losses.
2Power
If power distribution circuitry is placed in server racks, then power delivery is enabled, but heat stress compromises circuitry reliability
Solution Approach 1:
The patent integrates the power distribution circuitry with the liquid cooling subsystem in a common housing. The power distribution circuitry is positioned adjacent to the liquid cooling manifolds, allowing direct thermal coupling. This enables the liquid cooling system to actively cool the power distribution components, removing heat stress and improving circuitry reliability while maintaining full power delivery capability.
3Power
If liquid cooling manifolds and cabling are accommodated in rack zero-U area, then cooling and power distribution are enabled, but physical access for maintenance becomes difficult
Solution Approach 1:
The patent consolidates the power distribution circuitry, liquid cooling manifolds, supply lines, return lines, and associated cabling into a single integrated delivery device. This unified structure can be installed as one unit in the rack, simplifying installation and maintenance. The integrated design allows technicians to access and service the entire power-cooling system through a single enclosure rather than navigating congested individual components throughout the rack.
4Productivity
If high-density servers are installed in server racks, then computing capacity is increased, but heat rejection airflow becomes restricted compromising server performance
Solution Approach 1:
The patent employs liquid cooling hydraulics to replace air-based cooling for high-density servers. The liquid cooling manifolds with supply and return lines deliver coolant directly to server components, providing more efficient heat removal. This hydraulic cooling system overcomes the airflow restrictions inherent in densely packed server racks, enabling effective heat rejection and maintaining server performance at high densities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated system effectively manages power distribution and cooling, reducing heat-related issues and improving server performance by classifying loads into normal and atypical operational conditions, enabling timely maintenance and reducing downtime.
Implementation Method 1
a liquid cooling sub-system configured to provide active cooling to at least some of the plurality of loads, where the liquid cooling sub-system includes one or more manifolds providing one or more supply nozzles and one or more return nozzles for directing fluid for the active cooling
Implementation Method 2
one or more housings configured to at least partially enclose the power distribution sub-system and the liquid cooling sub-system, where the one or more housings further provide thermal coupling between the power distribution sub-system and the liquid cooling sub-system for at least partial cooling of at least a portion of the power distribution sub-system
Data Source
AI summary
A power distribution system may include a power distribution sub-system including power distribution circuitry to provide power from an input source to loads through outlets; a liquid cooling sub-system to provide active cooling to at least some of the loads, where the liquid cooling sub-system includes one or more manifolds providing one or more supply nozzles and one or more return nozzles for directing fluid for the active cooling; and one or more housings configured to enclose the power distribution sub-system and the liquid cooling sub-system, where the one or more housings further provide thermal coupling between the power distribution sub-system and the liquid cooling sub-system for at least partial cooling of at the power distribution sub-system. The system may further capture load diagnostic data associated with the loads and classify the loads into two or more classes based on the load diagnostic data.