Rackmount Optical Module Layout With Angled Boards and Inlet Fans
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Solution Overview
Problem
The increasing I/O capacities of electronic processing chips exceed the electrical signal capacity across a practical chip package size, necessitating efficient heat removal and optical signal transmission in data processing servers.
Innovation Solution
A system design with angled circuit boards, co-packaged optical modules, and strategically positioned inlet fans to enhance heat dissipation and optical-electrical signal conversion, utilizing a housing structure with inset panels and optimized fan placement for improved airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If optical modules are co-packaged with data processors to increase I/O capacity, then optical signal capacity is improved, but heat generation increases requiring more effective heat removal
Solution Approach 1:
The patent combines optical modules and data processors into a single co-packaged unit, integrating both components within the same package to reduce interconnect complexity and improve signal capacity while managing heat generation through shared thermal pathways
Solution Approach 2:
The patent introduces a specialized housing structure with integrated heat sinks and airflow channels that acts as an intermediary thermal management system, facilitating heat transfer from the co-packaged components to the surrounding environment
2Temperature
If inlet fans are positioned close to the front panel to enhance heat dissipation, then heat removal efficiency is improved, but structural space is reduced
Solution Approach 1:
The patent positions inlet fans at an angled orientation relative to the front panel rather than directly adjacent, utilizing three-dimensional spatial arrangement to achieve effective airflow and heat dissipation while preserving horizontal structural space within the housing
3Temperature
If circuit boards are positioned at an angle to the bottom panel to optimize airflow, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs asymmetric angular positioning of circuit boards relative to the bottom panel, creating non-uniform airflow patterns that enhance heat dissipation efficiency while the angular design is integrated into the manufacturing process to minimize additional complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat removal efficiency and increases optical signal capacity while maintaining a compact form factor, offering high power efficiency and flexible network connections.
Implementation Method 1
at least one heat sink thermally coupled to the at least one data processor and configured to remove heat from the at least one data processor during operation of the at least one data processor
Implementation Method 2
at least one inlet fan attached to a portion of the front panel other than the inset portion, and the at least one fan is configured to cause air to be blown towards the at least one heat sink
Implementation Method 3
each co-packaged optical module is configured to convert optical signals received from a corresponding fiber cable to electrical signals that are provided to the at least one data processor
Data Source
AI summary
An apparatus includes a rackmount device, in which the rackmount device includes a housing configured to be installed in a server rack, in which the housing has a width in a range from 16 to 20 inches and a height in a range from 1 to 12 inches, the housing includes a front panel, a rear panel, and a bottom surface. The rackmount device includes a first circuit board or substrate having a first surface that defines a length and a width of the first circuit board or substrate, in which the first circuit board or substrate is positioned relative to the housing such that the first surface of the first circuit board or substrate is at an angle relative to the bottom surface of the housing, and the angle is in a range from 45° to 90°. At least one of (i) the front panel of the housing is formed at least in part by the first circuit board or substrate, (ii) the first circuit board or substrate is attached to the front panel of the housing, or (iii) the first circuit board or substrate is substantially parallel to the front panel of the housing. The rackmount device includes at least one data processor electrically coupled to the first circuit board or substrate and configured to process data; and at least one optical/electrical communication interface coupled to the first circuit board or substrate and configured to convert received optical signals to electrical signals that are provide to the at least one data processor. The rackmount device includes at least one of (i) at least one inlet fan attached to the front panel of the housing, or (ii) at least one fan positioned near the front panel in which at least a portion of a fan blade of the at least one fan is within a first distance from the front panel for at least some time period during operation of the at least one fan, and the first distance is less than one-fourth of a second distance between the front panel and the rear panel.