Radar Antenna System With Backside Reflector
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Solution Overview
Problem
Conventional antenna-on-chip (AoC) solutions for millimeter wave (mm-wave) applications suffer from low antenna efficiency and low bandwidth due to the large influence of surrounding components, leading to increased package size, cost, and sensitivity to solder balls and interconnectivity issues.
Innovation Solution
The system incorporates a frontside and backside redistribution layer, a mold, a chip with a metalized reflector on its backside, and an antenna on the backside redistribution layer, with the antenna being electrically connected through the frontside redistribution layer, reducing the distance between the antenna and reflector and minimizing the impact of mold thickness, thereby reducing surface wave losses and improving alignment consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional antenna-on-chip (AoC) solutions are used, then integration is achieved, but antenna efficiency and bandwidth deteriorate due to large influence of surrounding components
Solution Approach 1:
The patent divides the antenna system into separate components: the antenna is integrated on-chip while the reflector is placed on the package substrate. This segmentation allows the antenna to maintain integration benefits while the separate reflector placement minimizes interference from surrounding components, thereby improving antenna efficiency and bandwidth.
Solution Approach 2:
The patent introduces a redistribution layer as an intermediary component between the antenna and the reflector. This intermediary layer enables electrical connection while providing spatial separation and minimizing the influence of surrounding components on the antenna's performance, thus maintaining both integration and efficiency.
2Device complexity
If conventional antenna-on-chip (AoC) solutions are used, then integration is achieved, but package size increases due to sensitivity to solder balls and interconnectivity issues
Solution Approach 1:
The patent merges the antenna and reflector into a single integrated package structure where the antenna is on-chip and the reflector is on the package substrate. This merging reduces the overall package size by eliminating the need for separate mounting components and reducing sensitivity to solder ball variations, while maintaining electrical connectivity through the redistribution layer.
3Manufacturing precision
If distance between antenna and reflector is increased, then manufacturing tolerance is improved, but surface wave losses increase
Solution Approach 1:
The patent optimizes the distance parameter between the antenna and reflector to a specific range that balances manufacturing tolerance and energy loss. By carefully controlling this parameter, the system achieves sufficient alignment consistency while minimizing surface wave losses, resolving the trade-off between manufacturing precision and energy efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a cost-effective, compact antenna package with improved radiation patterns and gain, reduced sensitivity to manufacturing variations, and increased durability, suitable for applications like automotive radar and mm-wave communication systems.
Implementation Method 1
The reflector is a metalized layer on a backside of the chip... The antenna is at least partially aligned with the reflector at a distance from the backside of the chip
Data Source
Figure 1~2
Figure 3a
Figure 3b
AI summary
A device is described. The device includes a chip, a reflector, and an antenna. The reflector is disposed on a surface of the chip. The reflector is a metalized layer on the surface of the chip.