Radar Apparatus Integrating Antenna and RF Circuit on Single PCB

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional radar apparatuses have a large size due to separate printed circuit boards for radar antenna and RF circuit modules, leading to increased size and limited mounting options, especially on vehicles.

Innovation Solution

A radar apparatus design where a first printed circuit board mounts both the radar antenna and base band circuit modules on one side, with the RF module wire-bonded and protected, and a second board for signal processing, all integrated with a base plate to minimize size and components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate PCBs are used for radar antenna module and RF circuit module, then signal transmission can be achieved, but the size of the radar apparatus is increased

Engineering Contradiction:
Improvesignal transmissionVSAvoidsize of radar apparatus
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent merges the radar antenna module and RF circuit module onto a single first PCB. The radar antenna module is mounted on the top side of the first PCB while the RF circuit module is wire-bonded to the same board, eliminating the need for separate PCBs and reducing overall apparatus size while maintaining signal transmission capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent utilizes the vertical dimension by wire-bonding the RF circuit module to the first PCB through holes, allowing three-dimensional integration of components on a single board plane. This vertical stacking approach reduces the horizontal footprint and overall volume of the radar apparatus.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If connection module is used to interconnect signal processing circuit module and RF circuit module, then signal processing can be achieved, but the size of the radar apparatus is increased

Engineering Contradiction:
Improvesignal processingVSAvoidsize of radar apparatus
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent integrates the signal processing circuit module and RF circuit module through direct coupling via a base plate, eliminating the need for a separate connection module. The base plate serves as a common mounting substrate that electrically and mechanically connects the modules, reducing component count and overall size.

Inventive Principle:
Principle #5Merging (Combining)

3Adaptability or versatility

If multiple separate modules are used, then functional requirements can be met, but the number of components is increased

Engineering Contradiction:
Improvefunctional requirementsVSAvoidnumber of components
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The first PCB serves multiple functions simultaneously: it mounts the radar antenna module, provides wire-bonding connections for the RF circuit module, and serves as a signal transmission medium. This multi-functional design reduces the number of separate components needed while meeting all functional requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent segments the first PCB into different functional areas: the top side for the radar antenna module, holes for wire-bonding the RF circuit module, and appropriate circuit traces for signal transmission. This segmentation allows a single component to fulfill multiple roles that would traditionally require separate modules.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the size and number of components, enhancing the flexibility in mounting the radar apparatus on vehicles by eliminating the need for separate modules and transition components.

Implementation Method 1

an RF circuit module is wire-bonded to the first printed circuit board through a hole

Methodology Applied
Scientific EffectWire-bonding: Soldering

Data Source

PatentUS9121928B2Radar apparatus and method of assembling the same
Publication Date: 2015.09.01 HL KLEMOVE CORP
  • US9121928B2 patent drawing
  • US9121928B2 patent drawing
  • US9121928B2 patent drawing

AI summary

Disclosed are a radar apparatus having a reduced size and a reduced number of components, and a method of assembling the radar apparatus.