Millimeter-Wave Radar Antenna Array Packaging for Beam Scanning
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Solution Overview
Problem
Existing single-chip packaging techniques for radar package modules are limited in their ability to form an antenna array, resulting in inadequate resolution and inability to effectively identify multiple objects at various angles due to the wide beam and limited number of packaged antennas.
Innovation Solution
A millimeter-wave radar package module is designed with a plurality of antenna units connected through a transmission line to form an antenna array, where the distance between adjacent antennas is optimized to improve resolution and enable beam scanning, utilizing a combination of planar patch, dipole, end-fire, or Vivaladi antennas, and manufactured using three-dimensional substrate or fan-out wafer-level packaging techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If single-chip packaging technique is used, then device complexity is reduced, but measurement precision deteriorates due to wide beam and limited antenna count
Solution Approach 1:
The invention segments the antenna system into multiple independent antenna units (at least four) that are separately packaged within the same package. Each antenna unit can be independently connected to transmitter and receiver channels, enabling the formation of an antenna array. This segmentation allows the system to achieve better resolution through array processing while maintaining a unified package structure.
Solution Approach 2:
The invention transitions from a single-channel packaging approach to a multi-channel three-dimensional antenna array configuration. By arranging multiple antenna units in specific spatial patterns (such as planar or volumetric arrays) and establishing corresponding transmitter-receiver connections, the system achieves enhanced resolution through spatial dimensionality without significantly increasing package complexity.
2Ease of manufacture
If single dipole antenna is used, then ease of manufacture is improved, but reliability deteriorates due to inability to identify multiple objects
Solution Approach 1:
The single dipole antenna is segmented into multiple antenna units with different radiation patterns. Each antenna unit is designed to cover specific angular ranges, and through coordinated operation of multiple units, the system achieves comprehensive multi-object detection capability while maintaining manufacturability through standardized antenna designs.
Solution Approach 2:
Each antenna unit is designed with universal characteristics that allow it to serve multiple functions: it can operate in different transmission and reception modes, support various beam forming patterns, and contribute to both single-target and multi-target detection. This multi-functionality enables reliable multi-object identification while using standardized, easy-to-manufacture antenna elements.
3Device complexity
If limited number of antennas are packaged, then device complexity is reduced, but measurement precision deteriorates due to insufficient resolution
Solution Approach 1:
The invention utilizes three-dimensional spatial arrangement of multiple antenna units to achieve enhanced angular resolution. By distributing antenna elements in specific geometric configurations (such as uniform linear arrays, planar arrays, or volumetric arrays) and applying array signal processing techniques, the system achieves fine angular resolution without requiring an excessive number of antennas or overly complex packaging.
Solution Approach 2:
The antenna array configuration enables dynamic beam steering and scanning capabilities. Through electronic control of phase and amplitude distribution across the antenna elements, the system can dynamically adjust beam directions and focus points, achieving high measurement precision for moving targets without mechanical movement or additional hardware complexity.
Data Source
AI summary
Provided is a millimeter-wave radar package module, which relates to antenna packaging. The millimeter wave radar package module includes a package and a plurality of antenna units packaged therein. The package includes a chip, and the chip includes a transmitter and a receiver. The antenna units are respectively connected to an output pin of the receiver and an output pin of the transmitter through a transmission line.