Radar Fill Level Measurement Device With Chips On Different Circuit Board Planes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current radar fill level measurement devices for recording the topology of a filling material surface in a container are complex, expensive, and prone to maintenance issues due to the need for multiple discrete high-frequency components and mechanical components, which are susceptible to harsh conditions.
Innovation Solution
A radar fill level measurement device utilizing highly integrated radar chips with multiple transmitters and receivers, combined with a field-programmable gate array (FPGA) for signal processing and a waveguide structure to reduce complexity and enhance robustness, allowing for fully electronic beamforming and efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple discrete high-frequency components are used to achieve precise fill level measurement and topology recording, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple discrete high-frequency components (transmitters, receivers, signal processing units) into a single integrated radar chip. This integration maintains the functional capabilities required for precise fill level measurement and topology recording while significantly reducing device complexity by eliminating the need for multiple separate components and their interconnections.
2Measurement precision
If multiple discrete high-frequency components and mechanical components are used, then measurement precision is improved, but reliability deteriorates due to susceptibility to harsh conditions
Solution Approach 1:
The patent replaces mechanical components with a fully electronic integrated radar chip system. This substitution eliminates mechanical wear, friction, and susceptibility to harsh environmental conditions, thereby improving reliability while maintaining the precision required for topology recording and fill level measurement through electronic signal processing.
3Measurement precision
If multiple discrete high-frequency components are used, then measurement precision is improved, but manufacturing cost increases
Solution Approach 1:
The patent integrates multiple high-frequency components into a single radar chip, which simplifies the manufacturing process by reducing the number of discrete components that need to be sourced, assembled, and tested. This integration maintains measurement precision while lowering manufacturing costs through economies of scale and reduced assembly complexity.
4Measurement precision
If more transmission and reception channels are used to scan the filling material surface more precisely, then measurement precision is improved, but energy consumption increases
Solution Approach 1:
The patent uses an integrated electronic radar chip system that replaces mechanical scanning mechanisms with electronic beamforming and signal processing capabilities. This allows for precise surface scanning through multiple virtual channels without the proportional increase in energy consumption that would result from multiple physical transmission and reception channels, as the integrated chip efficiently manages power distribution and signal processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-quality, robust, and cost-effective fill level measurement and topology recording with reduced hardware requirements and energy consumption, improving the reliability and efficiency of the measurement process.
Implementation Method 1
At least one of the transmission channels of the first radar chip is connected, via a first line, to an antenna assembly for radiating the transmission signal
Implementation Method 2
The first and/or the second waveguide is designed for connecting the first circuit board plane to the second circuit board plane
Implementation Method 3
Modern fill level measurement devices and topology measurement devices which are able to record the exact shape of the surface of a filling material are characterised not only by a high transmission frequency which is typically in the gigahertz range
Implementation Method 4
the first and/or the second waveguide comprises a resonant cavity in the end region thereof, which cavity is filled with a dielectric material
Data Source
AI summary
A radar fill level measurement device for fill level measurement or for recording a topology of a filling material surface in a container is provided, including: a circuit board including a first radar chip on a first circuit board surface and a second radar chip on a second circuit board surface, the first chip and the second chip each including one or more transmission channels configured to generate a transmission signal, and one or more reception channels configured to receive the transmission signal reflected at the filling material surface, at least one of the transmission channels of the first chip being connected, via a first line, to an antenna assembly for radiating the transmission signal, and at least one of the reception channels of the second adar chip being connected, via a second line, to the antenna assembly for receiving the reflected transmission signal.


