Phased Array Radar Circuit Stack With Integrated Liquid Cooling
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Solution Overview
Problem
Conventional tile-based and plank-based arrangements for active phased array systems face limitations in T/R channel density, functionality, and heat dissipation, particularly at higher frequencies, leading to reduced power class and increased antenna depth.
Innovation Solution
An electronic circuitry with integrated cooling channels, comprising a sandwich structure of circuit carriers and cooling plates, where cooling channels are directly closed by the carriers, allowing for efficient liquid cooling and reduced T/R channel height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If tile-based arrangement is used, then the structure is simple and easy to manufacture, but the T/R channel density is limited and heat dissipation is insufficient
Solution Approach 1:
The patent transitions from two-dimensional tile-based arrangement to three-dimensional stacked arrangement of circuit carriers. Multiple circuit carriers are stacked vertically with cooling plates interspersed between them, enabling T/R channels to be arranged in multiple layers. This dimensional change dramatically increases the T/R channel density within the same footprint area while maintaining ease of manufacturing through modular assembly.
2Quantity of substance
If plank-based arrangement is used, then the T/R channel density is improved, but the antenna depth is significantly increased
Solution Approach 1:
The patent divides the antenna structure into segmented modules consisting of circuit carriers and cooling plates. Each circuit carrier contains T/R channels, and cooling plates are interspersed between carriers. This segmentation allows for compact vertical stacking with integrated cooling, reducing the overall antenna depth compared to conventional plank-based arrangements while maintaining high T/R channel density.
3Temperature
If conventional cooling system is used, then the heat dissipation is limited, but the structure becomes more complex
Solution Approach 1:
The patent merges the cooling function directly into the structural assembly by integrating cooling plates between circuit carriers. The cooling plates form cooling channels that are structurally part of the antenna assembly, eliminating the need for separate external cooling systems. This integration improves heat dissipation efficiency while avoiding the complexity of additional cooling components and their installation.
4Quantity of substance
If reduced T/R channel size is used, then the channel density is improved, but the functionality and performance are limited
Solution Approach 1:
The patent enables full-functionality T/R channels to achieve high density by stacking circuit carriers vertically. Each circuit carrier can contain complete T/R channels with all necessary components (amplifiers, switches, phase shifters, etc.), and the vertical stacking arrangement allows these full-functional channels to be densely packed without reducing their size or capability. This dimensional arrangement maintains functionality while maximizing channel density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables higher integration density and efficient heat dissipation, supporting broadband, multifunctional, and lightweight AESAs that operate at higher frequencies with reduced depth and improved reliability.
Implementation Method 1
one or more cooling channels formed by the at least one cooling plate between the rear surface of the first circuit carrier and the rear surface of the second circuit carrier, the one or more cooling channels are adapted to accommodate a coolant to cool the one or more electronic components
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3
AI summary
An electronic circuitry (100) for an active phased array system with multiple transmit/receive, T/R, channels (101a 101b) is disclosed. The electronic circuitry (100) comprises: at least one pair of circuit carriers (110, 120), electronic components (200), at least one cooling plate (300), and one or more cooling channels (400). The at least one pair of circuit carriers (110, 120) includes a first circuit carrier (110) and a second circuit carrier (120), each circuit carrier (110, 120) having a front surface and a rear surface. The electronic components (200) are mounted on the front surface of the circuit carriers (110, 120), each electronic component (200) being associated with one or multiple of the T/R channels (101) to process transmit or receive signals. The at least one cooling plate (300) has two opposite sides, wherein the rear surface of the first circuit carrier (110) is attached to one side and the rear surface of the second circuit carrier (120) attached to an opposite side to hold the circuit carriers (110, 120) in a sandwich structure. The one or more cooling channels (400) are formed by the at least one cooling plate (300) between the rear surface of the first circuit carrier (110) and the rear surface of the second circuit carrier (120), the one or more cooling channels (400) are adapted to accommodate a coolant to cool the one or more electronic components (200).