Radar Fill Level Sensor Thermal Neck Design

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Solution Overview

Problem

Radar-based fill-level measurement devices face challenges in high-temperature environments due to the limitations of electronic components, which typically withstand only up to 80°C, and the need for high thermal resistance in the housing neck to prevent overheating at high frequencies.

Innovation Solution

A radar-based fill-level measurement device with a housing neck made of thermally conductive materials like stainless steel, aluminum, or copper, designed to maintain the electronics module temperature below 80°C even at temperatures up to 200°C, achieved by optimizing the thermal resistance through geometric design and potentially incorporating thermally insulating elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the housing neck is designed with high thermal resistance to protect electronic components from high temperatures, then the electronic components are protected, but the device cannot be applied at high radar frequencies requiring the electronics to be close to the antenna

Engineering Contradiction:
Improveprotection of electronic componentsVSAvoidapplicability at high radar frequencies
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The housing neck is divided into two distinct sections: an upper section with high thermal resistance for protecting electronics, and a lower section with low thermal resistance for efficient signal transmission. This segmentation allows each section to optimize its function independently, resolving the contradiction between thermal protection and signal transmission requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different thermal resistance properties are applied to different parts of the housing neck. The upper part has high thermal resistance to protect electronics from heat, while the lower part has low thermal resistance to ensure good signal transmission. This local differentiation of properties allows the single component to satisfy conflicting requirements in different regions.

Inventive Principle:
Principle #3Local quality

2Reliability

If the housing neck is made long and narrow to increase thermal resistance, then thermal protection is improved, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvethermal protectionVSAvoidhousing neck design
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Instead of using a long, narrow housing neck geometry to achieve high thermal resistance, the invention changes the material parameter (thermal conductivity) of the housing neck. By selecting materials with appropriate thermal conductivity values, the desired thermal protection is achieved with a shorter, simpler neck geometry, reducing manufacturing complexity.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The housing neck is constructed from composite materials or material combinations that provide the required thermal resistance properties without requiring complex geometries. This allows thermal protection to be achieved through material selection rather than through elaborate structural design.

Inventive Principle:
Principle #40Composite materials

3Measurement precision

If the electronics module is arranged close to the antenna for high frequency signal transmission, then signal transmission is improved, but the electronic components are exposed to high temperatures

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidelectronics module temperature
Core Design Contradiction:
Measurement precisionVSTemperature

Solution Approach 1:

The housing neck acts as an intermediary element between the antenna and the electronic components. It provides a thermal barrier that protects the electronics from high temperatures while allowing the electronics to remain positioned close to the antenna for optimal signal transmission. The intermediary structure resolves the conflict between thermal exposure and signal transmission requirements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for accurate fill-level measurements at high temperatures while maintaining the electronics module at a safe temperature, enhancing the device's temperature resistance and compactness, and improving measurement accuracy compared to prior art.

Implementation Method 1

a housing neck, which is arranged between the housing and the antenna, wherein the housing neck has between the housing and the antenna a predefined thermal resistance (Rth,H)

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an antenna, which is embodied in such a manner and arranged on the container, in order to transmit electromagnetic waves (THF) in the direction of the fill substance and/or to receive electromagnetic waves (RHF) reflected in the container

Methodology Applied
Scientific EffectElectromagnetic radiation: Electromagnetic Induction

Data Source

PatentUS11187570B2Temperature-resistant fill level measurement device
Publication Date: 2021.11.30 ENDRESS & HAUSER GMBH & CO KG
  • US11187570B2 patent drawing
  • US11187570B2 patent drawing
  • US11187570B2 patent drawing

AI summary

The present disclosure relates to a radar-based fill-level measurement device for measuring a fill level of a fill substance located in a container. Besides a housing, the device includes an antenna and a housing neck, which is arranged between the housing and the antenna, wherein the housing neck has between the housing and the antenna a predefined thermal resistance, and at least one electronics module partially arranged in the housing neck. The thermal resistance of the housing neck is dimensioned in such a manner to be low, such that, at a temperature in the container of at least 200° C., the temperature at the electronics module is limited to, at most, 80° C. Thus, a high resolution and temperature-resistant and simultaneously compact, fill-level measurement device is provided for high radar frequencies of, for example, 79 GHz.