Radar PCB Shielding Layout for EMI Control and Lateral Heat Transfer
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Solution Overview
Problem
Conventional EMI shielding and thermal management solutions for automotive radar sensors are inadequate, particularly when electronic components are mounted on a side of the circuit board closer to the radome, as traditional thru-board heat sinking is not feasible due to discrete components on the opposing side.
Innovation Solution
An EMI shielding and thermal management system comprising a shield member disposed above the integrated circuit, extending to unpopulated areas of the PCB, and pin members inserted through apertures to transfer heat energy away from the integrated circuit, with the shield member potentially made of stamped metal or graphite, and pin members creating an air-tight thermal connection with a thermally conductive environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional thru-board heat sinking is used, then thermal energy can be dissipated through the circuit board, but this solution is not feasible when electronic components are mounted on the radome side of the PCB due to discrete components blocking heat transfer paths
Solution Approach 1:
The patent transitions from traditional through-board heat sinking (z-dimension) to a lateral heat transfer approach using shield members that extend to unpopulated areas of the PCB and transfer heat laterally to thermally conductive members on the same side, effectively moving the heat dissipation path to a different dimensional plane
Solution Approach 2:
The shield member acts as an intermediary thermal transfer component, receiving heat from the integrated circuit and transferring it to thermally conductive members (such as aluminum cases or thermally conductive plastics) that are part of the external environment, bypassing the need for direct through-board heat paths
2Object-affected harmful factors
If EMI shielding is implemented using conventional methods, then electronic components can be protected from electromagnetic interference, but thermal management becomes compromised when components are mounted near the radome
Solution Approach 1:
The shield member is designed to perform multiple functions simultaneously: it provides EMI shielding to protect the integrated circuit while also serving as a thermal transfer component that conducts heat away from the circuit to thermally conductive members in the external environment
Solution Approach 2:
The patent merges the EMI shielding function and thermal management function into a single integrated shield member structure, eliminating the need for separate shielding and heat sinking components that would conflict with component placement constraints
3Temperature
If pin members are made oversized relative to apertures, then an air-tight thermal connection is created for improved heat transfer, but manufacturing and assembly complexity increases
Solution Approach 1:
The pin members are pre-designed with oversized dimensions relative to the apertures they will pass through, and the assembly process includes a deliberate forcing insertion step that creates permanent deformation and friction-fit connections, establishing the air-tight thermal interface before final assembly completion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively shields the integrated circuit from EMI and manages thermal energy, preventing overheating and potential damage, while allowing for improved heat dissipation to an external environment.
Implementation Method 1
a shield member disposed above the integrated circuit and extending to unpopulated areas of the PCB and configured to shield the integrated circuit from EMI
Implementation Method 2
transfer heat energy generated by the integrated circuit away from the integrated circuit
Implementation Method 3
configured to transfer the heat energy from the shield member to an environment external to the PCB
Data Source
AI summary
An electromagnetic interference (EMI) shielding and thermal management system, method, and automotive radar system for an integrated circuit of a product circuit board (PCB) of a radar sensor includes a shield member disposed above the integrated circuit and extending to unpopulated areas of the PCB and configured to shield the integrated circuit from EMI and transfer heat energy generated by the integrated circuit away from the integrated circuit, and a set of pin members configured to be inserted through respective apertures defined by the shield member and the PCB and configured to transfer the heat energy from the shield member to an environment external to the PCB.