Vehicle Radar PCB Wave Termination via Multi-Layer Substrate

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Solution Overview

Problem

Existing radar systems for vehicles face challenges in designing a cost-effective and simple wave termination that minimizes signal reflections, as current solutions like absorber mats and separate wave termination components are expensive and require additional space or are unsuitable for high-frequency applications.

Innovation Solution

A multi-layer circuit board design with a low-loss first substrate layer and a high-loss second substrate layer, where the wave termination leads the signal from the low-loss layer to the high-loss layer, achieving attenuation and absorption without additional components, using a substrate integrated waveguide and a microstrip conductor configuration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an absorber mat made of high-loss material is placed at the end of the conductor to achieve wave termination, then signal reflection is minimized, but manufacturing cost increases and additional process steps are required

Engineering Contradiction:
Improvesignal reflection minimizationVSAvoidmanufacturing cost and process complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The wave termination function is merged with the existing substrate structure by creating a through-hole that penetrates the substrate and connecting conductive layers. This eliminates the need for separate absorber mats while achieving the same signal termination effect through the inherent resistive properties of the conductive paths and substrate material.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate and its conductive layers serve the dual purpose of structural support and signal termination. The through-hole configuration with conductive connections creates an inherent wave termination mechanism that does not require additional components or materials, allowing the circuit board itself to provide the termination function.

Inventive Principle:
Principle #25Self-service

2Reliability

If a separate wave termination component is soldered onto the cable end to achieve impedance matching, then signal reflection is reduced, but component cost increases and frequency range is limited

Engineering Contradiction:
Improveimpedance matchingVSAvoidcomponent count and assembly steps
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The wave termination functionality is integrated directly into the circuit board structure through through-holes that connect multiple conductive layers. This eliminates the need for separate termination components while achieving impedance matching through the distributed capacitive and resistive effects of the layered conductive structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The through-hole structure serves multiple functions simultaneously: it provides mechanical support, electrical connection between layers, and wave termination through its resistive and capacive properties. This multi-functional design works across a broad frequency range without requiring frequency-specific components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Loss of energy

If an antenna is used as wave termination to radiate the signal, then signal absorption is achieved, but interference with other radar antennas occurs

Engineering Contradiction:
Improvesignal absorptionVSAvoidelectromagnetic interference
Core Design Contradiction:
Loss of energyVSObject-generated harmful factors

Solution Approach 1:

Instead of radiating the terminated signal as with an antenna, the energy is converted into heat through resistive dissipation in the conductive paths and substrate. This converts the potentially harmful radiated energy into harmless thermal energy, eliminating interference while maintaining effective signal termination.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The substrate and conductive layers serve as both the transmission medium and the termination mechanism. The inherent resistive properties of the conductive materials provide the necessary energy dissipation without requiring separate absorption materials or antenna structures.

Inventive Principle:
Principle #25Self-service

4Reliability

If additional absorber layers are added to the circuit board to achieve wave termination, then signal reflection is minimized, but manufacturing complexity and cost increase

Engineering Contradiction:
Improvesignal termination effectivenessVSAvoidlayer structure and manufacturing processes
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The wave termination function is combined with the existing multi-layer substrate structure by creating through-holes that connect conductive layers across the substrate. This utilizes the existing layer structure for its intended purpose while simultaneously providing termination, eliminating the need for additional absorber layers.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The termination effect is achieved by changing the electrical parameters (resistance and capacitance) through the through-hole configuration and conductive layer connections rather than by adding materials with different physical properties. This allows termination to be achieved through geometric and material parameter optimization of existing structures.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design results in a low-reflection, cost-effective wave termination that effectively absorbs high-frequency signals, reducing manufacturing costs and eliminating the need for additional absorber layers, while maintaining high signal integrity and minimizing interference.

Implementation Method 1

a second substrate layer made of a second material with a second loss factor in order to attenuate, dampen, or absorb the signal

Methodology Applied
Scientific EffectElectromagnetic absorption: Absorption (EM radiation)

Data Source

PatentEP3134748B1Radar system for detecting sourroundings of a vehicle and printed circuit board for said radar system
Publication Date: 2021.10.20 CONTI TEMIC MICROELECTRONIC GMBH
  • EP3134748B1 patent drawingFigure 1~2
  • EP3134748B1 patent drawingFigure 3~4
  • EP3134748B1 patent drawingFigure 5~6

AI summary

The invention relates to a radar system (2) for a vehicle for detecting the surroundings thereof, with a printed circuit board (4), comprising a wave termination (36) with a termination line (78), a signal line (38) connected thereto for transmitting a high-frequency signal, a first substrate layer (22), produced from a first material with a first loss factor, a first layer (20) applied to the first substrate layer (22), said first layer comprising the signal line (38), a second substrate layer (26), produced from a second material having a second loss factor which is larger than the first loss factor, and a second layer (28) applied to the second substrate layer (26), said second layer comprising the termination line (78). The invention further relates to a printed circuit board (4) for such a radar system (2).