Radar Sensor Housing-Holder Overmolding for Heat Dissipation
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Solution Overview
Problem
Radar sensors with plastic housings suffer from inefficient heat dissipation due to air gaps and low thermal conductivity of plastics, leading to high temperature areas during operation, and the production process is complex.
Innovation Solution
A metal holder with a complementary outer contour is overmolded with plastic to create a large contact surface with the housing, facilitating heat transfer and electromagnetic shielding, using materials like aluminum die-cast or sheet metal with glass fiber-reinforced PBT plastic.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the housing and holder are joined individually with adhesive surfaces or points, then the production process is simplified, but the heat dissipation efficiency deteriorates due to limited contact area
Solution Approach 1:
The housing is molded directly onto the holder in a single integrated structure, merging two previously separate components. This creates extensive adhesive contact surfaces between the housing base and holder, replacing the limited adhesive points of prior art. The merging enables both simplified production (single molding operation) and improved heat dissipation (large thermal contact area).
Solution Approach 2:
The arrangement combines metal holder material with plastic housing material in a composite structure. The metal holder provides thermal conduction pathways, while the plastic housing provides insulation and structural protection. The composite design allows the housing to serve dual functions: structural enclosure and thermal management surface, improving heat dissipation without complicating production.
2Device complexity
If adhesive surfaces or points are used between housing and holder, then the manufacturing complexity is reduced, but the thermal conduction capability deteriorates
Solution Approach 1:
The housing and holder are merged into a single molded component, eliminating the need for separate adhesive application processes. The molding process creates inherent bonding between the housing base and holder surfaces, reducing manufacturing steps while simultaneously creating large, reliable thermal contact areas for efficient heat conduction.
Solution Approach 2:
The invention changes the contact geometry parameter from discrete adhesive points to continuous adhesive surfaces. By increasing the contact area parameter between housing and holder, the thermal conduction capability is enhanced. The molding process enables this parameter change while keeping the manufacturing process relatively simple.
3Ease of manufacture
If only the base area provides adhesive contact, then the production process is simplified, but the heat dissipation performance deteriorates due to high temperature areas
Solution Approach 1:
The thermal contact interface is extended from the two-dimensional base area to include the vertical side wall surfaces. This dimensional extension allows heat to be dissipated through multiple surfaces (base and sides) rather than just the base, improving temperature distribution uniformity. The molding process naturally creates this multi-surface contact geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation and simplifies production by creating a robust, thermally conductive interface between the holder and housing, reducing high temperature areas and improving operational efficiency.
Implementation Method 1
The heat dissipation of an electronic circuit arrangement of the radar sensor takes place via a metal component holder
Implementation Method 2
The contact surfaces of the housing can include the side walls and the base in particular
Data Source
AI summary
The invention relates to an arrangement with a holder and a housing for an electronic assembly, in particular for a radar sensor, and an assembly with such an arrangement, in particular the radar sensor. Further components of the electronic assembly can be attached to the holder, for example a circuit carrier with an electronic circuit arrangement. The housing or a part of the housing is molded onto the holder, and the holder has an outer contour which is wholly or partially complementary to an inner contour of the housing, in particular of a part of the housing.