Configurable radar tile architecture
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional planar phased array radar systems face challenges such as high manufacturing costs, thermal management issues due to heat sinks, and limited flexibility for adapting to different applications, primarily due to the integration of transmit/receive modules within the aperture assembly, which requires redesigns when changing amplifier types.
Innovation Solution
A configurable phased array tile architecture with vertical transmit and receive cards that relocate transmit functionality, utilize modular daughter card assemblies, and integrate heat sinks directly on the cards, allowing for flexible reconfiguration and reduced layer complexity in the aperture assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If transmit/receive modules are integrated within the aperture assembly, then signal routing is simplified, but manufacturing cost increases and adaptability decreases
Solution Approach 1:
The patent segments the radar system into modular components: aperture assemblies with radiating elements, separate transmit cards with amplifiers, and receive cards with LNA circuits. These modular cards connect to the aperture assembly via connectors, allowing independent replacement and reconfiguration. This segmentation enables different amplifier types (GaAs, GaN, etc.) to be swapped by simply replacing transmit cards rather than redesigning the entire aperture assembly, thus maintaining signal routing simplicity while dramatically improving adaptability.
2Temperature
If heat sinks are added for thermal management, then thermal performance improves, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent merges the heat sink function directly into the transmit card assembly. The heat sink is integrated with the amplifier package on the transmit card, forming a single combined component. This approach improves thermal management by providing dedicated heat dissipation for high-power amplifiers while avoiding the need for separate, complex thermal management systems. The integrated design reduces manufacturing cost by simplifying assembly steps and reducing the number of separate components that need to be installed and aligned.
3Device complexity
If multiple layers are used in the aperture assembly, then signal routing capability improves, but manufacturing cost increases
Solution Approach 1:
The patent moves signal routing from a planar two-dimensional approach within the aperture assembly layers to a three-dimensional approach using vertical cards that extend perpendicular to the aperture face. The transmit and receive cards provide vertical signal paths between the aperture assembly and the backplane, reducing the need for complex multi-layer routing within the aperture assembly itself. This dimensional transition simplifies aperture assembly manufacturing while maintaining comprehensive signal routing capability through the vertical card interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This architecture reduces manufacturing costs, improves thermal management, and enhances flexibility by enabling easy adaptation to different radar applications without redesigning the entire assembly, while maintaining consistent RF output power across tiles.
Implementation Method 1
at least one high power transmit amplifier for powering at least one radiating element connected to the aperture assembly
Implementation Method 2
each of the plurality of vertical transmit cards includes a heat sink mounted to a side of the vertical transmit card to draw heat from the at least one high power transmit amplifier
Implementation Method 3
at least one fan positioned to force air flow through at least one channel between rows of the plurality of vertical transmit cards
Data Source
AI summary
A configurable phased array tile is disclosed including an aperture assembly having a plurality of aperture assembly connectors, a backplane assembly having a plurality of backplane assembly connectors, and a plurality of vertical transmit cards mounted to a corresponding first plurality of aperture assembly connectors and a corresponding first plurality of backplane assembly connectors. The plurality of vertical transmit cards each include a plurality of transmit channels including at least one high power transmit amplifier for powering at least one radiating element mounted to the aperture assembly.