Radar Level Gauge Waveguide Cooling for High-Temperature Tanks

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Solution Overview

Problem

Radar level gauge systems face challenges in withstanding high temperatures, especially when operating at higher frequencies, as existing solutions like thermal insulation and heat-dissipating materials can complicate assembly and compactness.

Innovation Solution

A radar level gauge system design featuring a hollow waveguide with a heat-dissipating structure and thermal connections arranged to minimize heat conduction paths, where the first thermal connection has lower resistance than the second, allowing efficient heat dissipation and maintaining the transceiver's temperature within safe limits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thermal insulation is used to protect measurement electronics from high temperatures, then the electronics can withstand high tank temperatures, but the device complexity increases due to additional insulation layers and components

Engineering Contradiction:
Improveheat resistanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the measurement electronics from the high-temperature environment by placing them in a separate housing that is thermally isolated from the tank. The antenna remains in the tank while the electronics are removed to a protected environment, eliminating the need for complex insulation around the electronics while maintaining heat resistance.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a waveguide as an intermediary element that couples the antenna (in the high-temperature tank environment) to the measurement electronics (in the protected housing). This waveguide acts as a thermal barrier while allowing electromagnetic signal transmission, providing thermal isolation without requiring additional insulation layers.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Temperature

If heat-dissipating materials and structures are added to the housing, then the transceiver temperature is reduced, but the device complexity and assembly difficulty increase

Engineering Contradiction:
Improvetransceiver temperatureVSAvoidassembly complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the heat-dissipating function directly into the housing structure itself, making the housing both protective and thermally managing. The housing includes heat-dissipating elements such as fins or extended surfaces that are integrated into its design, eliminating the need for separate heat-dissipating components and simplifying assembly.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing serves multiple functions simultaneously: it protects the measurement electronics, provides thermal isolation from the tank, dissipates heat from the transceiver, and maintains structural integrity. This multi-functionality reduces the need for additional components and simplifies the overall device architecture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Volume of moving object

If the housing is designed to enclose both transceiver and waveguide with integrated heat dissipation, then the system becomes more compact, but the manufacturing precision requirements increase

Engineering Contradiction:
Improvesystem compactnessVSAvoidassembly precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent segments the system into distinct functional modules: the antenna assembly (with waveguide) and the housing (containing transceiver and heat-dissipating structures). This segmentation allows each module to be manufactured and tested separately with standard tolerances, then assembled together, reducing the overall manufacturing precision requirements compared to a fully integrated design.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces the temperature of the transceiver, even at high tank temperatures, enhancing the system's heat resistance and compactness while maintaining measurement accuracy.

Implementation Method 1

a hollow waveguide for guiding the transmit signal in a signal propagation direction from a first end of the hollow waveguide facing the transceiver towards a second end of the hollow waveguide facing the antenna

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Implementation Method 2

a first thermal connection between the hollow waveguide and the heat-dissipating structure; and a second thermal connection between the hollow waveguide and the housing arranged at a second distance, in the signal propagation direction, from the second end of the hollow waveguide

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11982562B2Radar level gauge system with improved heat dissipation
Publication Date: 2024.05.14 ROSEMOUNT TANK RADAR
  • US11982562B2 patent drawing
  • US11982562B2 patent drawing
  • US11982562B2 patent drawing

AI summary

A radar level gauge system include a transceiver; an antenna; a hollow waveguide for guiding the transmit signal from a first end facing the transceiver towards a second end facing the antenna; a housing including a heat-dissipating structure arranged at a first distance from the second end; a first thermal connection between the hollow waveguide and the heat-dissipating structure; and a second thermal connection between the hollow waveguide and the housing arranged at a second distance, shorter than the first distance, from the second end. The first and second thermal connection are arranged such that a thermal resistance of a first heat conduction path from the second end of the hollow waveguide through the first thermal connection to the heat-dissipating structure, is lower than a thermal resistance of a second heat conduction path from the second end of the hollow waveguide through the second thermal connection to the housing.