Radar Sensor Waveguide Injection Molding on Circuit Board
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Solution Overview
Problem
Radar sensors face challenges in being easily manufactured with low tolerances and are susceptible to environmental influences, with existing technologies often resulting in warped products and corrosion-prone joints.
Innovation Solution
The waveguide structure is formed in a mold injection-molded onto a circuit board supporting the high-frequency component, eliminating the need for additional fastening means and reducing the risk of corrosion, while allowing for precise alignment and integration of the waveguide structure with the high-frequency component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If additional fastening means are used to connect the waveguide structure to the circuit board, then the connection strength is improved, but the product warping increases and manufacturing complexity increases
Solution Approach 1:
The waveguide structure is integrally molded directly onto the circuit board in a single injection molding process, merging two previously separate components (waveguide structure and circuit board) into one integrated assembly. This eliminates the need for additional fastening means while maintaining strong connection and avoiding warping issues associated with separate fastening operations.
2Strength
If additional fastening means are used to connect the waveguide structure to the circuit board, then the connection strength is improved, but the device complexity increases
Solution Approach 1:
The waveguide structure and circuit board are combined into a single integrally molded component, eliminating multiple separate parts and fastening mechanisms. This reduces device complexity while maintaining connection strength through the integral connection formed during injection molding.
3Strength
If joints between the waveguide structure and circuit board are created, then the connection is established, but corrosion susceptibility increases
Solution Approach 1:
By integrally molding the waveguide structure directly onto the circuit board, the invention eliminates separate joints and interfaces between components. This integral connection prevents corrosion that would otherwise occur at joint surfaces, while still establishing a strong mechanical and electrical connection.
4Manufacturing precision
If the waveguide structure is molded with narrow dimension tolerances, then the positioning precision is improved, but the manufacturing difficulty increases
Solution Approach 1:
The circuit board is precisely positioned and fixed within the mold cavity before the injection molding process begins. This preliminary positioning action ensures that the waveguide structure is molded with narrow dimension tolerances relative to the high-frequency component, while the molding process itself automatically maintains these tolerances without requiring additional post-processing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of robust radar sensors with narrow dimension tolerances, avoiding warping and corrosion issues, and allows for the integration of multiple layers and complex antenna arrays with reduced manufacturing complexity.
Implementation Method 1
the waveguide structure is formed in a mold, which is injection molded on a part of the circuit board supporting the high-frequency component
Data Source
AI summary
A radar sensor. The radar sensor includes a high-frequency component situated on a circuit board and a waveguide structure, which is connected via a coupling structure to the high-frequency component. The waveguide structure is formed in a mold, which is injection molded to a part of the circuit board supporting the high-frequency component.