Radar Chip Package Waveguide Transition Without PCB Losses
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Solution Overview
Problem
Radar assemblies using printed circuit boards (PCBs) introduce electrical losses that reduce signal transmission and reception range and increase manufacturing costs.
Innovation Solution
Eliminating the intermediate PCB by using air waveguides and electrical channels directly connecting radar chip packages to antennas, with transitions designed to minimize signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an intermediate PCB is used to facilitate connections between radar chip packages and waveguides, then ease of manufacture and device assembly are improved, but electrical losses increase reducing signal transmission and reception range
Solution Approach 1:
The patent extracts and removes the intermediate PCB from the radar assembly, directly connecting radar chip packages to waveguides through optimized mounting structures. This elimination of the PCB intermediary removes the source of electrical losses while maintaining manufacturing feasibility through direct bond attachment and integrated connector designs.
Solution Approach 2:
The patent introduces new intermediary elements such as optimized mounting brackets, direct-coupled connectors, and transition structures that enable direct connection between radar chip packages and waveguides without requiring a PCB. These new intermediaries provide mechanical support and electrical connection while minimizing signal loss compared to traditional PCB-based approaches.
2Ease of operation
If an intermediate PCB is used to facilitate connections, then device assembly is simplified, but manufacturing costs increase due to additional materials and assembly steps
Solution Approach 1:
By removing the PCB from the assembly, the patent eliminates material costs associated with the board, copper traces, soldering materials, and assembly operations. The direct connection approach reduces bill of materials costs and simplifies the manufacturing bill while maintaining assembly capability through specialized mounting structures.
Solution Approach 2:
The patent merges the functions of the PCB (mechanical support, electrical connection, signal transmission) into integrated components such as waveguide-mounted connectors and directly attached radar chip packages. This consolidation eliminates the need for separate PCB assembly operations while maintaining all necessary functions, thereby reducing manufacturing complexity and cost.
3Loss of energy
If PCB is eliminated in favor of direct waveguide connections, then signal transmission range is improved, but device complexity increases
Solution Approach 1:
The patent introduces specialized transition structures and mounting intermediaries that enable direct connection between radar chip packages and waveguides. These intermediaries provide the necessary mechanical support, electrical transition, and signal coupling while maintaining a relatively simple overall architecture. The complexity is localized to specific connection points rather than distributed throughout a PCB structure.
Solution Approach 2:
The patent applies localized optimization at critical connection points between radar chip packages and waveguides, using specialized transition structures only where needed for signal coupling. The majority of the system maintains a simple direct-connect architecture, concentrating complexity only in the localized transition regions rather than requiring a complex overall system design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances signal transmission and reception range while reducing material and manufacturing costs by eliminating PCB-related losses.
Implementation Method 1
air waveguides and electrical channels directly connecting radar chip packages to antennas
Data Source
Figure 1
Figure 2A~2C
Figure 3A~3C
AI summary
A transceiver (10) includes first electrical channels (24) and second electrical channels (24). The first electrical channels (24) are configured to transfer electromagnetic signals to first air waveguides (22). Each of the first electrical channels (24) extend from a transmitter along an exterior surface (20) of a chip package (12) that supports the transmitter and terminate at first transitions (26) on the exterior surface (20). Each of the first plurality of air waveguides (22A) are attached to the exterior surface (20) and overlay one of the first transitions (26). The transceiver (10) also includes second electrical channels (24) configured to transfer second electromagnetic signals from second air waveguides (22). Each of the second electrical channels (24) extend from a receiver along the exterior surface (20) of the chip package (12) that supports the receiver and terminate at second transitions (30) on the exterior surface (20). Each of the second air waveguides (22) are attached to the exterior surface (20) and overlay one of the second transitions (30).