Radial Cluster Substrate Treatment Layout
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Solution Overview
Problem
The increasing miniaturization and high-density integration of semiconductor devices require more efficient semiconductor manufacturing processes, necessitating a layout of chambers that improves throughput and reduces substrate transfer routes within a fixed space.
Innovation Solution
A substrate treatment apparatus with a cluster structure, including a load port, a transfer module, and a treatment module comprising a load lock chamber, a transfer chamber, a first treatment chamber, and a second treatment chamber, where the second treatment chamber is strategically positioned between the transfer chamber and the transfer module to facilitate direct substrate transfer and reduce unnecessary handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chambers are arranged in a conventional linear sequence, then the substrate transfer route becomes long and complex, but the number of treatment chambers that can be accommodated in fixed space is limited
Solution Approach 1:
The patent transitions from a conventional linear arrangement of chambers to a two-dimensional layout where treatment chambers are positioned around the transfer chamber in a radial configuration. This dimensional change allows multiple chambers to be accessed from a central transfer point, reducing the substrate transfer route while accommodating more chambers within the same footprint area, thereby improving throughput without increasing complexity
2Productivity
If more treatment chambers are added to increase throughput, then the processing capacity improves, but the apparatus occupies more space
Solution Approach 1:
By arranging treatment chambers around the transfer chamber in a radial pattern rather than in a linear sequence, the patent effectively utilizes two-dimensional space. This allows multiple chambers to be positioned at different angular positions around a central transfer point, increasing the number of chambers that can be accommodated within a fixed circular or square footprint, thereby improving throughput without proportionally increasing the apparatus area
3Loss of time
If the substrate transfer route is minimized to improve efficiency, then the throughput increases, but the chamber layout becomes more constrained
Solution Approach 1:
The transfer chamber serves as a universal hub that can transfer substrates to any of the surrounding treatment chambers. This multi-functional design allows the same transfer chamber to interface with multiple different chambers, providing layout flexibility while maintaining short transfer routes. The system can accommodate various chamber configurations and process sequences without requiring complex dedicated transfer paths between each chamber pair
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a higher number of treatment chambers within a fixed space, enhancing semiconductor device throughput by minimizing substrate transfer routes and optimizing processing efficiency.
Implementation Method 1
a decompression member for decompressing the inside of the housing
Implementation Method 2
a heating member for heating the substrate placed on the support member
Implementation Method 3
a plasma source generating plasma; and a supply tube supplying the generated plasma into the housing
Data Source
AI summary
Provided are an apparatus and method for treating a substrate, and more particularly, to a substrate treatment apparatus having a cluster structure and a substrate treatment method using the same. The apparatus for treating the substrate includes a load port on which a container for receiving the substrate is placed, a treatment module for treating the substrate, and a transfer module including a robot for transferring the substrate between the container and the treatment module. The treatment module includes a transfer chamber including a robot for transferring the substrate, a load lock chamber disposed between the transfer chamber and the transfer module, a first treatment chamber disposed spaced from the transfer module around the transfer chamber to perform a first treatment process, and a second treatment chamber disposed around the transfer chamber to perform a second treatment process.