Radial Contact Device for Compact Power Semiconductor Modules
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Solution Overview
Problem
Existing contact devices for power semiconductor components in disc cells and modules are not compact enough for universal application and have complex assembly processes, limiting their use in compact modules.
Innovation Solution
A contact device with a molded metal body and a multi-part insulating housing, featuring a contact spring with a pin-like extension for secure pressure contact and a crimped connection to a cable, allowing for simple assembly and reduced height, enabling reliable electrical connections in power semiconductor modules and disc cells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a contact device with insulating sleeve, contact spring, and molded body is used, then reliable electrical contact is ensured, but the overall height becomes large and cannot be arranged in compact modules
Solution Approach 1:
The contact device is redesigned to extend radially outward from the gate electrode in the horizontal plane rather than vertically in the height direction. The shaped metal bodies with contact surfaces are arranged radially, allowing the contact device to fit within the compact vertical space while maintaining reliable electrical contact through the radial extension.
2Reliability
If a wire element guided in plastic sleeve with spring is used, then contact is maintained, but the configuration is not amenable to rational production with smallest number of prefabricated assemblies
Solution Approach 1:
The contact device merges multiple components into a integrated molded body structure. The shaped metal bodies are formed as a single molded component with multiple radial extensions, each having contact surfaces. This integration eliminates the need for separate wire elements, plastic sleeves, and springs, enabling rational production with fewer prefabricated assemblies.
Solution Approach 2:
The molded body is designed as a universal contact device structure that can accommodate multiple gate connections simultaneously. The radial arrangement of shaped metal bodies allows the same molded body design to serve multiple contact functions, reducing the variety of prefabricated assemblies needed for different connection configurations.
3Adaptability or versatility
If multiple contact devices are arranged in molded body with recesses, then universal application is achieved, but device complexity increases
Solution Approach 1:
The molded body is segmented into multiple identical or similar recesses arranged radially, each capable of receiving a contact device. This modular segmentation allows the same basic structure to be repeated for different numbers of connections (e.g., 3, 4, or more gates), achieving universal applicability without designing entirely different structures for each application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, universally applicable contact device that ensures reliable electrical connections and simplifies assembly, making it suitable for use in both single and multiple power semiconductor components within disc cells and modules.
Implementation Method 1
The contact device itself consists of a contact spring with a pin-like extension on that first end of the spring that faces the power semiconductor component
Implementation Method 2
a crimped connection to a cable
Data Source
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AI summary
An arrangement comprising a power semiconductor device in a power semiconductor module, wherein a shaped body is arranged above the power semiconductor device, the shaped body having at least one recess and at least one contact device for auxiliary connection of the power semiconductor device, the contact device being provided for arrangement in a recess. The contact device consists of a contact spring with a pin-like extension at the first end of the spring facing the power semiconductor device, and a metal shaped body arranged at the second end of the spring, the metal shaped body having a first connecting device designed as a planar section parallel to the power semiconductor device, and a second connecting device for connection to a connecting cable, and a multi-part insulating housing for arranging the contact spring and the metal shaped body.