Radial Electrostatic Chuck Layout for Etch Uniformity Control
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Solution Overview
Problem
Conventional electrostatic chucks in plasma processing apparatuses cause process non-uniformities due to the layout of electrodes, leading to side-to-side etch rate non-uniformity patterns, which existing designs fail to adequately address.
Innovation Solution
A unique radial layout for the clamping electrodes with thermally isolated and electrically connected zones, combined with a thermal control system and a sealing band, to improve temperature control and uniformity during plasma processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrode layout is used in electrostatic chuck, then the chuck can hold workpiece during plasma processing, but process non-uniformities and side-to-side etch rate non-uniformity patterns occur
Solution Approach 1:
The electrostatic chuck is divided into multiple independently controllable electrode zones (first electrode, second electrode, third electrode, fourth electrode) arranged in a specific pattern. Each zone can be controlled separately to compensate for non-uniformities, allowing the system to maintain workpiece holding capability while improving process uniformity across different regions of the workpiece.
2Manufacturing precision
If temperature control is improved during plasma processing, then process uniformity increases, but thermal management complexity increases
Solution Approach 1:
The thermal control system is segmented into multiple independently controllable heating zones corresponding to different electrode regions. Each zone can be temperature-controlled separately, allowing precise thermal management to improve process uniformity without requiring a completely complex centralized system.
Solution Approach 2:
The electrostatic chuck structure serves multiple functions: it provides workpiece holding through electrostatic forces, temperature control through integrated heating zones, and process uniformity improvement through coordinated electrode and thermal control. This multi-functionality reduces the need for separate dedicated systems.
3Temperature
If heat exchange gas flow is increased to improve cooling, then temperature control improves, but gas leakage likelihood increases
Solution Approach 1:
The sealing band is designed with specific local properties (material composition, thickness, geometric profile) optimized for sealing performance. This localized enhancement at critical sealing positions allows higher gas flow rates for improved cooling while maintaining reliable sealing to prevent leakage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances process uniformity by creating four thermally isolated zones for improved temperature control and reduces the likelihood of heat exchange gas leakage, making the electrostatic chuck more durable and effective in maintaining consistent processing conditions.
Implementation Method 1
the electrostatic chuck assembly 200 includes a first electrode 202, a second electrode 204, a third electrode 206, and a fourth electrode 208
Implementation Method 2
improve temperature control and uniformity during plasma processing
Data Source
AI summary
An electrostatic chuck including a clamping layer having a first clamping electrode and a second clamping electrode is disclosed. A first clamping electrode defining a first clamping zone and a second clamping zone is provided. The first clamping zone and the second clamping zone are separated by a first gap and are electrically connected by at least one electrical connection extending across the first gap. A second clamping electrode disposed radially outward from the first clamping electrode. The second clamping electrode defining a third clamping zone and a fourth clamping zone that are separated by a second gap. The third clamping zone and the fourth clamping zone are electrically connected by at least one electrical connection extending across the second gap. Plasma processing apparatuses and systems incorporating the electrostatic chuck are also provided.