Radial Gas Flow Nozzle for Substrate Contamination Prevention
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Solution Overview
Problem
Substrate contamination during the treatment process in semiconductor and display device manufacturing due to foreign matter and treatment liquid mist adhering to the substrate surfaces.
Innovation Solution
A substrate treatment apparatus with a gas ejection nozzle positioned adjacent to the substrate to form a radial gas-flow that covers and protects the substrate from foreign particles and mist, preventing contamination by isolating the substrate from ambient particles and mist.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate treatment apparatus is used to treat substrates, then substrate treatment is achieved, but foreign matter and treatment liquid mist adhere to the substrate causing contamination
Solution Approach 1:
A gas flow is introduced as an intermediary substance between the substrate and the harmful environment. The gas flow acts as a protective barrier that prevents foreign matter and treatment liquid mist from adhering to the substrate surface, thereby maintaining substrate cleanliness without requiring physical shielding structures
Solution Approach 2:
The patent creates a protected atmosphere around the substrate using gas flow. This inert gas environment isolates the substrate from contaminants in the ambient air and treatment liquid mist, effectively preventing contamination while allowing the treatment process to proceed
2Reliability
If a gas ejection nozzle is positioned adjacent to the substrate to form a radial gas-flow, then substrate protection from contamination is achieved, but apparatus size may increase
Solution Approach 1:
The gas ejection nozzle is designed to generate a radial gas flow that automatically covers and protects the substrate. The system uses the substrate's own position and the gas flow's natural radial expansion to create protection, eliminating the need for additional shielding structures or complex positioning mechanisms
Solution Approach 2:
The patent utilizes changes in gas flow parameters (radial direction, flow rate, pressure) to achieve effective substrate protection. By optimizing these parameters, the system maintains compact dimensions while ensuring comprehensive coverage of the substrate surface with the protective gas flow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents contamination of substrates by creating a clean environment around the substrate, ensuring reliable protection against foreign matter and mist, while maintaining a compact apparatus size.
Implementation Method 1
The gas ejection nozzle is configured to eject the gas radially from the gas ejection port over the substrate held by the substrate holding unit to form a gas-flow for covering the substrate
Data Source
AI summary
A substrate treatment method employs a substrate holding unit, a gas ejection nozzle, and a gas supply unit. The substrate holding unit is configured to hold a substrate. The gas supply unit is configured to supply a gas to the gas ejection nozzle. The gas ejection nozzle is disposed to be positioned adjacent a center portion of the substrate held by the substrate holding unit. The gas ejection nozzle has a gas ejection port. The gas ejection nozzle is configured to eject the gas radially from the gas ejection port over the substrate held by the substrate holding unit to form a gas-flow for covering the substrate.