Radial Oscillating Heat Pipe Layout for Microelectronics Heat Spreading

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Solution Overview

Problem

Existing oscillating heat pipes are limited by linear heat spreading due to the condenser and evaporator sections being on opposite ends of a rectangular structure, which does not effectively manage heat concentrations in microelectronics.

Innovation Solution

The oscillating heat pipe is configured with a radial design where the condenser section surrounds the evaporator section, and the fluid channels extend radially between them, increasing in density and forming loops or nested arrangements to enhance heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the condenser and evaporator sections are positioned on opposite ends of a rectangular structure, then the device complexity is reduced and manufacturing is simplified, but the heat spreading is limited to linear direction which is insufficient for managing heat concentrations in microelectronics

Engineering Contradiction:

Improveheat spreading capabilityVSAvoidstructural complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent transitions from a linear one-dimensional heat spreading path to a radial two-dimensional heat spreading configuration. The evaporator section is positioned at the center and the condenser section surrounds it radially, allowing heat to spread in multiple directions simultaneously (360 degrees around the evaporator) rather than along a single linear path. This dimensional change enables effective cooling of concentrated heat sources in microelectronics by distributing heat across a larger peripheral area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If the evaporator section is made much smaller than the condenser section to match microelectronics heat concentrations, then the heat transfer efficiency is improved, but the linear rectangular configuration cannot effectively concentrate the evaporator on the heat source

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidgeometric adaptability

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The patent employs asymmetric radial geometry where the evaporator section is concentrated at the center (small area) and the condenser section forms a surrounding annular structure (large area). This asymmetric configuration naturally adapts to concentrated heat sources in microelectronics, allowing the small central evaporator to efficiently absorb heat from electronic components while the large peripheral condenser provides extensive heat dissipation surface area.

Inventive Principle:

Principle #4Asymmetry

3Temperature

If fluid channels are arranged in a radial configuration with increasing density away from the condenser, then the heat spreading performance is enhanced, but the manufacturing precision requirements increase

Engineering Contradiction:

Improveheat spreading performanceVSAvoidchannel density gradient precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent implements local quality variation in the fluid channel design, where channel density increases progressively from the inner radius (near evaporator) to the outer radius (near condenser). This non-uniform channel distribution optimizes heat transfer by providing higher channel density in regions where heat flux is highest (near the evaporator) and gradually reducing density toward the condenser. The gradual gradient approach balances performance enhancement with manufacturability.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This radial configuration improves heat spreading by concentrating the evaporator on the heat source and maximizing peripheral heat dissipation, effectively cooling electronics components.

Implementation Method 1

Intermittent evaporation and condensation of working fluid transfers the vapor from the evaporator to condenser

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 2

Intermittent evaporation and condensation of working fluid transfers the vapor from the evaporator to condenser

Methodology Applied

Scientific EffectCondensation: Condensation

Implementation Method 3

Oscillating heat pipes typically include two main sections, a condenser section and an evaporator section that are interconnected by looping channels

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Data Source

PatentUS20260049770A1Radial oscillating heat pipe for enhanced heat spreading

Publication Date: 2026.02.19 RAYTHEON CO

AI summary

An oscillating heat pipe includes an evaporator section, a condenser section, and a plurality of fluid channels extending between the evaporator section and the condenser section, the plurality of fluid channels containing a volume of heat transfer fluid. The condenser section surrounds the evaporator section. An electronics system includes an electronic component, and an oscillating heat pipe positioned at the electronic component configured to remove thermal energy from the electronic component. The oscillating heat pipe includes an evaporator section, a condenser section, and a plurality of fluid channels extending between the evaporator section and the condenser section. The plurality of fluid channels contain a volume of heat transfer fluid. The condenser section surrounds the evaporator section.