Radial Hub Connector for High-Density Circuit Board Cooling
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Solution Overview
Problem
Current orthogonal packaging systems for circuit boards are limited by mechanical and space constraints, allowing only a maximum of 68 boards to be connected, and lack direct connections between parallel boards, leading to reduced operating speed due to indirect communication pathways.
Innovation Solution
A multi-dimensional connector system featuring a circular interconnecting hub with radially configured circuit board bays, providing direct data pathways between all boards, allowing each board to communicate directly with every other board without needing to route through orthogonal stacks, and incorporating fluid coolant storage and wedge-shaped heat sinks for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If orthogonal packaging system is used to connect circuit boards, then connection between perpendicular boards is achieved, but the number of boards is limited to maximum 68 due to mechanical and space constraints
Solution Approach 1:
The patent transitions from a two-dimensional orthogonal grid layout to a three-dimensional cylindrical configuration. Circuit boards are arranged radially around a central hub in multiple layers, utilizing vertical space and radial dimensions to accommodate significantly more boards (up to 192) within a compact footprint, thereby resolving the contradiction between board quantity and floor space occupation.
Solution Approach 2:
The invention employs a nested structure where circuit boards are arranged in concentric radial layers around a central interconnecting hub. Inner boards are surrounded by outer boards, and multiple layers are stacked vertically, creating a compact nested configuration that maximizes board density while minimizing the overall system volume and floor space requirement.
2Speed
If orthogonal packaging system is used, then connection between perpendicular boards is established, but direct connection between parallel boards is not possible requiring indirect communication pathways
Solution Approach 1:
The radial-cylindrical arrangement enables any two circuit boards to establish direct communication pathways through the central hub regardless of their spatial relationship. Boards that were previously parallel and required indirect routing through perpendicular boards now have direct radial pathways to the hub, simplifying the communication topology and improving operating speed by eliminating unnecessary intermediate hops.
Solution Approach 2:
The central interconnecting hub serves as a universal connection point that provides direct access to all circuit boards simultaneously. This multi-functional hub enables any board to communicate directly with any other board through a standardized radial pathway, replacing the limited orthogonal connection model where boards could only directly connect to perpendicular neighbors.
3Quantity of substance
If maximum number of boards (68) are connected in orthogonal system, then connection capacity is maximized within constraints, but space efficiency is reduced requiring large floor space
Solution Approach 1:
By transitioning from a planar orthogonal arrangement to a three-dimensional cylindrical configuration with radial board placement and vertical layering, the system accommodates nearly triple the number of boards (192 vs. 68) while occupying significantly less floor space. The vertical stacking and radial distribution utilize unused dimensional space, reducing the horizontal footprint.
Solution Approach 2:
The nested concentric arrangement of circuit boards around the central hub creates a compact, space-efficient configuration. Boards are organized in radial layers that nest within each other, maximizing the utilization of the cylindrical volume and minimizing the overall system envelope, thereby reducing both floor space and total volume requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the connection of a larger number of circuit boards with improved operating speed and reduced space requirements, achieving superior bisection bandwidth and efficiency compared to existing systems, as demonstrated by the comparison with IBM BlueGene/L and Cray Red Storm systems.
Implementation Method 1
a fluid coolant storage container located beneath the interconnecting hub, a support structure at least partially surrounding the interconnecting hub, configured to support the plurality of circuit boards connected to the plurality of circuit board bays, a plurality of fluid heat sinks interspersed within the support structure interspersed between spaces configured to receive circuit boards, such that the fluid coolant storage container is in fluid communication with the plurality of fluid heat sinks
Implementation Method 2
a plurality of fluid heat sinks interspersed within the support structure interspersed between spaces configured to receive circuit boards
Data Source
AI summary
A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.