Radial LED Chip Module for 360-Degree Illumination
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Solution Overview
Problem
Conventional LED lamps have complex structures, high production costs, low light brightness, uneven lighting, and are not capable of self-emitting in 360 degrees, with poor filament stability and light-blocking issues due to integrated circuit placement.
Innovation Solution
A smart multi-color light dimming LED chip module featuring a transparent circuit board with a control IC, multiple light-emitting chips of different colors, and metal terminals, allowing for 360-degree emission and dynamic color transformation, with a column driver control IC and protection circuit to prevent damage from reverse voltage or pulse current.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional SMD integrating multiple colors with 180-degree planar light-emitting structure is used, then optical structures such as light guiding column are required to emit lights in 360 degrees, but the structure becomes complex and product cost increases
Solution Approach 1:
Instead of using a conventional 180-degree planar SMD structure that requires external optical structures to achieve 360-degree emission, the patent inverts the approach by designing an LED bulb with the light source at the center and multiple LED chips arranged radially around it. This centralised configuration naturally emits light in 360 degrees without requiring additional optical guiding structures, thereby achieving full-sphere illumination while simplifying the overall structure.
Solution Approach 2:
The patent transitions from a two-dimensional planar SMD structure to a three-dimensional radial configuration. Multiple LED chips are arranged in different spatial dimensions around the central bulb, creating a volumetric light-emitting structure that achieves 360-degree coverage through spatial distribution rather than requiring complex optical guiding elements.
2Adaptability or versatility
If conventional LED lamps with integrated circuit close to light-emitting circuits are used, then control and adjustment of colors and color temperatures is possible, but the IC chips block lights and cause shadows
Solution Approach 1:
The patent extracts the control IC from its conventional position near the light-emitting circuits and relocates it to the base of the bulb. This separation removes the blocking element (IC) from the light path, eliminating shadows while preserving color control functionality. The control signals are transmitted through electrical connections rather than requiring physical proximity to the LEDs.
Solution Approach 2:
The control IC is relocated from the horizontal plane near the LEDs to the vertical base of the bulb. This dimensional repositioning moves the control component out of the light emission path while maintaining electrical connectivity, allowing light to pass unobstructed through the central bulb region.
3Device complexity
If light-emitting chips in current light-emitting circuits are connected in series, then circuit control is simplified, but stability of LED filaments is poor and they may easily be damaged
Solution Approach 1:
The patent segments the light-emitting circuit into multiple independent parallel branches, each containing one or more LED chips. This segmentation allows individual chips or branches to operate independently, so that if one chip fails, others continue to function. The control IC manages each branch separately, providing both simplified control and improved reliability through redundancy.
Solution Approach 2:
The patent changes the circuit configuration parameter from series connection to parallel connection. This parameter change fundamentally alters the reliability characteristics of the circuit, as parallel connections provide alternative current paths and reduce the impact of individual component failures, thereby improving overall system stability while maintaining control simplicity through the IC.
4Adaptability or versatility
If conventional LED lamps with complex structures are used, then multiple functions can be integrated, but production cost increases
Solution Approach 1:
The patent implements multi-functionality through a single integrated bulb design that combines dynamic color changing, dimming control, and 360-degree illumination capabilities. The control IC provides universal control over multiple LED chips with different color characteristics, enabling the system to perform multiple functions (color mixing, brightness adjustment, pattern generation) without requiring separate specialized components for each function, thereby reducing production costs.
Solution Approach 2:
The patent merges multiple LED chips of different colors and control functions into a single integrated bulb assembly. By combining red, green, blue, and white LED chips along with the control IC in one unified structure, the design achieves multiple functions (color mixing, dimming, dynamic effects) in a single manufacturable unit, simplifying production compared to assembling multiple separate functional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the structure, reduces production costs, achieves even lighting, and allows for attractive 360-degree emission with improved stability and dynamic color effects, while preventing light blocking and enhancing reliability.
Implementation Method 1
at least three light-emitting chips of different colors... capable of self-emitting in 360 degrees... dynamic color transformation
Data Source
AI summary
A smart multi-color light dimming LED chip module, a bulb, and a light string are provided. The smart multi-color light dimming LED chip module includes a transparent circuit board, a control integrated circuit (IC), four metal terminals, at least three light-emitting chips of different colors. The control IC is disposed on the transparent circuit board, and the at least three light-emitting chips are uniformly disposed at a first side of the control IC on the transparent circuit board. The four metal terminals are disposed at a second side of the control IC on the transparent circuit board, the four metal terminals are respectively and electrically connected to a power supply pin, a ground pin, a signal input pin, and a signal output pin of the control IC. A conductive pattern is disposed on each of at least two circuit layers of the transparent circuit board.