Radial Substrate Treating Apparatus Layout
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Solution Overview
Problem
Conventional substrate treating apparatuses face inefficiencies due to long process times, excessive movement of transfer robots, vortex generation, and challenges in miniaturizing the equipment layout, leading to defects and increased complexity.
Innovation Solution
The apparatus is designed with an index module, buffer module, and treating module arranged sequentially along specific directions, featuring transfer robots that minimize movement distance and time, and includes heat treatment and solution treatment chambers to optimize substrate processing, while reducing vortex formation and equipment size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the transfer robot moves along a broad range direction to transfer substrates between chambers, then the substrate can be transferred to each chamber, but the process time lengthens
Solution Approach 1:
The patent transitions from a linear one-dimensional chamber arrangement to a two-dimensional layout where chambers are positioned around a central transfer robot. This allows the robot to service multiple chambers by moving in radial directions rather than traversing long linear distances, significantly reducing transfer time while maintaining full chamber access capability
2Ease of operation
If the transfer robot moves along a direction to transfer substrates, then the substrate can be transferred between chambers, but a vortex is generated causing process defects
Solution Approach 1:
Instead of having chambers arranged linearly and the robot move along the linear axis, the patent inverts the approach by positioning chambers radially around the robot and having the robot move in radial directions. This reversal of the conventional layout eliminates the vortex generation problem while preserving substrate transfer functionality
3Ease of manufacture
If components are arranged with conventional layout, then each component can be positioned, but the substrate treating apparatus cannot be miniaturized
Solution Approach 1:
The patent merges multiple chamber access functions into a single central transfer robot position, with chambers arranged radially around it. This consolidation eliminates the need for separate access paths to each chamber, dramatically reducing the overall apparatus footprint while maintaining all necessary component functions
Solution Approach 2:
By transitioning from a linear one-dimensional layout to a two-dimensional radial arrangement, the patent packs more chambers into a smaller overall area. The central robot serves all chambers within a compact circular footprint, enabling apparatus miniaturization while preserving manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration shortens processing hours, decreases transfer robot movement, minimizes vortex generation, and allows for equipment miniaturization, thereby enhancing efficiency and reducing defects.
Implementation Method 1
wherein the cooling unit is configured to cool the substrate inside of the housing
Implementation Method 2
wherein the heating unit is configured to heat the substrate inside of the housing
Data Source
AI summary
An apparatus for treating a substrate is provided having a treating module, a buffer module, and an index module arranged in sequentially along a first direction. The index module includes a load port where a substrate receiving container places an index module configured to transfer the substrate between the load port and the buffer module. The buffer module includes a first and second buffer unit arranged along a second direction perpendicular to the first direction. The treating module includes a first treating unit, a second treating unit, a first transfer chamber, and a second transfer chamber, wherein the first transfer chamber includes a first transfer robot configured to transfer the substrate between the first buffer unit and the first treating unit, and wherein the second transfer chamber includes a second transfer robot configured to transfer the substrate between the second buffer unit and the second treating unit.