Radial Susceptor Support Arms for Pin Binding Reduction

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing semiconductor processing systems face quality control issues due to physical interactions between substrates and susceptors, including pin binding and non-uniform deposition, particularly during the transfer and processing of substrates with excessive bowing or patterned substrates, which can lead to substrate damage and non-uniform thermal edge film uniformity.

Innovation Solution

The design incorporates a susceptor support system with radially extending support arms and apertures that allow lift pins to contact the susceptor at a single point, reducing friction and the likelihood of pin binding, and includes silicon carbide-coated components to enhance thermal uniformity and reduce substrate damage during loading and unloading.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If lift pins contact the susceptor at multiple points, then the susceptor is more stable during lifting, but friction increases causing pin binding and substrate damage

Engineering Contradiction:
Improvesusceptor lifting stabilityVSAvoidpin binding and substrate damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The susceptor support structure is segmented into multiple radial support arms that are distributed around the susceptor. This segmentation allows the lifting force to be distributed across multiple discrete contact points (lift pins) rather than concentrated at one location, providing stable lifting while maintaining controlled friction at each individual pin-susceptor interface

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces lift pins as intermediary elements between the susceptor support arms and the susceptor. These lift pins act as mediators that transfer the lifting force from the support arms to the susceptor, reducing direct friction and preventing pin binding while ensuring stable suspension of the susceptor during transfer operations

Inventive Principle:
Principle #24Intermediary (Mediator)

2Adaptability or versatility

If substrates with excessive bowing are processed, then manufacturing flexibility is improved, but non-uniform deposition and substrate damage occur

Engineering Contradiction:
Improveprocessing capability for bowing substratesVSAvoiddeposition uniformity
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The susceptor support system employs dynamic lift pins that can adjust their vertical positions independently to accommodate substrates with varying degrees of bowing. This dynamic adjustment capability allows the system to maintain uniform deposition by compensating for substrate irregularities while preserving the ability to process diverse substrate types

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent implements local quality control through individually adjustable lift pins at different radial positions on the susceptor. Each lift pin can be independently positioned to account for local variations in substrate bowing, ensuring uniform deposition across the entire substrate surface even when processing substrates with excessive bowing

Inventive Principle:
Principle #3Local quality

3Device complexity

If traditional susceptor support structures are used, then device complexity is reduced, but thermal edge film uniformity deteriorates

Engineering Contradiction:
Improvesusceptor support structureVSAvoidthermal edge film uniformity
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent transitions from traditional single-point or two-point susceptor support to a multi-dimensional radial support arm configuration. Multiple support arms extend radially from the center, distributing thermal and mechanical loads across multiple dimensions. This dimensional expansion improves thermal edge film uniformity while maintaining manageable device complexity through modular arm design

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration minimizes substrate damage and improves thermal and film uniformity by reducing friction and pin binding, allowing for more reliable and efficient substrate handling and processing, especially for substrates with excessive bowing or patterned designs.

Implementation Method 1

silicon carbide-coated components to enhance thermal uniformity

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

contact the susceptor at a single point, reducing friction and the likelihood of pin binding

Methodology Applied
Scientific EffectFriction: Friction

Data Source

PatentUS20220181193A1High performance susceptor apparatus
Publication Date: 2022.06.09 ASM IP HLDG BV
  • US20220181193A1 patent drawing
  • US20220181193A1 patent drawing
  • US20220181193A1 patent drawing

AI summary

A substrate support and lift assembly configured to support and lift a substrate from a susceptor is disclosed. The substrate support and lift assembly can include a susceptor support and a lift pin. The susceptor support can be configured to support the susceptor thereon. The susceptor support includes a plurality of support arms each extending radially from a central portion of the susceptor support to a terminus. Each of the plurality of support arms includes an aperture extending therethrough. The lift pin can be configured to fit through the aperture of a corresponding support arm to lift a substrate on the susceptor.