Radial Window Laser Holder for Semiconductor Beam Alignment

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Solution Overview

Problem

Existing semiconductor laser holders fail to precisely control the direction of the laser beam emission and effectively manage heat dissipation, leading to potential beam misalignment and thermal strain.

Innovation Solution

A laser holder with a metal body featuring a cylindrical housing and radially arranged windows for symmetric adhesive bonding, utilizing ultraviolet light to set the adhesive simultaneously and ensure precise centering, while allowing for heat dissipation through a combination of thermal conductivity and symmetrical adhesive distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive is applied to fasten the semiconductor laser element, then the laser element is securely held, but the adhesive may set unevenly causing misalignment and improper centering

Engineering Contradiction:
Improvesecure holding of laser elementVSAvoidcentering precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The housing is divided into multiple segments with recesses positioned at different locations around the laser element. Each recess receives adhesive independently, allowing the adhesive to set uniformly across all segments. This segmentation prevents uneven adhesive setting that would cause misalignment, while still providing secure holding through multiple attachment points.

Inventive Principle:
Principle #1Segmentation

2Temperature

If heat exchange surface is increased to remove heat, then heat dissipation is improved, but thermal gradients may cause strain and misalignment

Engineering Contradiction:
Improveheat dissipationVSAvoidstructural stability
Core Design Contradiction:
TemperatureVSStability of the object's composition

Solution Approach 1:

The housing incorporates specific regions with enhanced heat exchange properties positioned strategically around the laser element. These local heat exchange zones are distributed symmetrically to ensure uniform heat removal, preventing thermal gradients that would cause differential expansion and structural strain. The local quality enhancement targets heat dissipation without compromising overall structural stability.

Inventive Principle:
Principle #3Local quality

3Manufacturing precision

If the laser element is firmly fixed to control position, then centering is improved, but adjustment capability is reduced

Engineering Contradiction:
Improvecentering precisionVSAvoidposition adjustment
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The housing is designed with adjustable components that allow the laser element to be positioned and centered during assembly, then firmly fixed once the optimal position is achieved. The recesses and adhesive application mechanism enable initial adjustment followed by secure fixation, providing both positioning flexibility and final stability.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables precise and reproducible centering of the semiconductor laser element, effective heat management, and adjustable position and orientation, minimizing thermal strain and ensuring reliable beam emission direction.

Implementation Method 1

simultaneously setting the adhesive in all the windows by means of ultraviolet light penetrating simultaneously into all the windows

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

Known laser holders therefore also have the aim of helping to remove this heat, especially by increasing the heat exchange surface about the laser

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10483715B2Laser support for semiconductor laser fixation and laser support element assembly
Publication Date: 2019.11.19 GOOGLE LLC
  • US10483715B2 patent drawing
  • US10483715B2 patent drawing
  • US10483715B2 patent drawing

AI summary

Method for mounting a semiconductor laser element (3) into a laser holder (1), comprising the following steps:providing a laser holder (1) comprising a metal body (2) equipped with a substantially cylindrical housing (20) and comprising a frontal end (21) equipped with a first aperture (210) for passage of the laser beam produced by said laser element, and a back end (22) equipped with a second aperture (220) for inserting said laser element (3), said body (2) being passed through by a first group of windows (51, 52) arranged radially in a first plane (P1) perpendicular to the axis (23) of said housing (20), the angular spacing between said windows (51, 52) being regular;inserting said semiconductor laser element (3) into said housing (20);inserting an adhesive (24) for fastening said semiconductor laser element (3) into said windows (51, 52); andsimultaneously setting the adhesive in said windows (51, 52) by means of ultraviolet light penetrating simultaneously into said windows (51, 52).