Radiant Heat Drying for Electronic Components

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Solution Overview

Problem

Existing methods for separating, drying, and inspecting electronic components are inefficient, as they either displace liquid uncontrollably, require lengthy heating cycles, or involve physical contact that can damage components and lead to bacterial growth and inconsistent drying.

Innovation Solution

A device using a heating source that generates radiant heat in the near-infrared range (1 μm to 5 μm) to selectively evaporate residual liquid from electronic components, combined with visual inspection means and an intelligent control system to ensure efficient and controlled drying and inspection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heated plates are used to evaporate liquid from electronic components, then the liquid can be removed, but the process becomes slow and requires long cycle time

Engineering Contradiction:
Improveliquid removal effectivenessVSAvoiddrying cycle time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent replaces conventional thermal conduction heating (heated plates) with radiant heating (infrared or microwave radiation). This substitution allows energy to be directly absorbed by the liquid molecules, enabling rapid evaporation without the slow heat transfer through plates and components, thus dramatically reducing drying cycle time while maintaining effective liquid removal.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes the phase transition of liquid to vapor through radiant heating. By applying electromagnetic radiation that resonates with water molecules (infrared or microwave frequencies), the liquid rapidly absorbs energy and transitions from liquid to vapor phase, achieving fast drying without prolonged thermal contact.

Inventive Principle:
Principle #36Phase transitions

2Reliability

If heated plates are used to dry electronic components, then liquid can be evaporated, but physical contact must be made between components and plates

Engineering Contradiction:
Improveliquid evaporation effectivenessVSAvoidphysical contact damage
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces mechanical contact-based heating (heated plates requiring physical touch) with contactless radiant heating. Infrared or microwave radiation can penetrate and heat the liquid on components without physical contact, eliminating the risk of mechanical damage to vulnerable electronic components while maintaining effective evaporation.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If blowing means are used to remove residual liquid, then liquid can be displaced, but the displacement occurs in an undefined manner and liquid can be displaced to non-desired positions

Engineering Contradiction:
Improveliquid removal capabilityVSAvoidliquid displacement control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent replaces aerodynamic blowing means with electromagnetic radiant heating. Instead of using air flow to physically push liquid around (which creates uncontrolled displacement), radiant energy directly evaporates the liquid in place, providing precise control over where and how liquid is removed without displacing it to unwanted locations.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Reliability

If tamponing equipment is used to remove moisture, then adhering moisture can be absorbed, but the moisture-absorbent material becomes saturated and bacterial growth can occur

Engineering Contradiction:
Improvemoisture absorption effectivenessVSAvoiddrying effectiveness over time
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The patent replaces contact-based tamponing with moisture-absorbent materials with contactless radiant heating for evaporation. This eliminates the saturation problem inherent in absorbent materials, as radiant energy continuously evaporates moisture without being limited by the capacity of any material. It also prevents bacterial growth by avoiding contact with organic absorbent materials.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution allows for efficient and controlled removal of residual liquid, minimizing heating of electronic components, enabling effective visual inspection and reducing cycle time, while preventing overheating and bacterial growth.

Implementation Method 1

a heating source for generating radiant heat; wherein the heating source is configured to generate radiant heat with a wavelength in the range of 1 μm to 5 μm

Methodology Applied
Scientific EffectRadiant heat: Thermal Radiation

Implementation Method 2

Such a radiant heat has a wavelength in the near-infrared region

Methodology Applied
Scientific EffectNear-infrared radiation: Infrared Radiation

Implementation Method 3

selective heating and remove by means of evaporation the residual liquid present on the electronic components

Methodology Applied
Scientific EffectEvaporation: Evaporation

Implementation Method 4

Water for instance has a strong absorption for infrared light (1-5 μm wavelength). It is as a result of this that particularly the liquid absorbs energy from the radiant heat

Methodology Applied
Scientific EffectAbsorption of electromagnetic radiation: Absorption (EM radiation)

Data Source

PatentUS9435584B2Device and method for separating, at least partially drying and inspecting electronic components
Publication Date: 2016.09.06 BESI NETHERLANDS BV
  • US9435584B2 patent drawing
  • US9435584B2 patent drawing
  • US9435584B2 patent drawing

AI summary

The invention relates to a device for separating, at least partially drying and inspecting electronic components, comprising: separating means, a carrier for the electronic components, a heating source for generating radiant heat, displacing means for displacing the carrier for the electronic components relative to the heating source, and visual inspection means. The heating source is configured to generate radiant heat in order to selectively heat and evaporate moisture present on the separated electronic components.