Radiant Heating Plate With Refractive Elements For Wafer Uniformity
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Solution Overview
Problem
Conventional processing equipment for semiconductor wafers is ineffective in preventing pattern collapse during drying due to limited precision and optimum temperature profile in heating, especially as feature dimensions decrease and wafer diameters increase.
Innovation Solution
A radiant heating plate with a central region free of heating elements, utilizing refractive elements such as lenses to redirect radiation towards the center, ensuring uniform heating and preventing pattern collapse by rapidly evaporating rinse liquids before meniscus formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heating methods are used, then heating coverage is achieved, but temperature uniformity deteriorates due to inability to heat central region precisely
Solution Approach 1:
The heating plate features a central region free of heating elements, creating different thermal characteristics in different zones. The central region without heating elements prevents overheating, while peripheral regions with heating elements provide necessary heat, achieving uniform temperature distribution across the wafer surface.
Solution Approach 2:
The heating plate is segmented into a central region without heating elements and peripheral regions with heating elements. This segmentation allows independent thermal control of different zones, enabling precise temperature management and uniform heating across the entire wafer surface.
2Temperature
If heating elements are distributed uniformly across the heating plate, then overall heating is achieved, but central region overheating occurs preventing pattern collapse prevention
Solution Approach 1:
The heating plate design creates local thermal differences by removing heating elements from the central region. This local modification prevents excessive heat concentration in the center, enabling precise temperature control that prevents pattern collapse while maintaining overall heating effectiveness.
3Area of stationary object
If conventional heating plates with continuous heating elements are used, then heating coverage is maximized, but temperature profile precision deteriorates
Solution Approach 1:
The heating plate is divided into functional zones: a central region without heating elements and peripheral regions with heating elements. This segmentation maintains extensive heating coverage while achieving precise temperature profile control by preventing heat concentration in the central area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents pattern collapse by ensuring uniform and precise heating of semiconductor wafers, rapidly evaporating rinse liquids and maintaining wafer integrity during processing.
Implementation Method 1
The radiant heating plate further comprises at least one refraction element that refracts radiation emitted by the radiant heating elements and passed through the at least one refraction element, toward the central region of the radiant heating plate
Implementation Method 2
A radiant heating plate faces a wafer-shaped article when positioned on the rotary chuck. The radiant heating plate comprises radiant heating elements
Implementation Method 3
rapidly evaporating rinse liquids before meniscus formation
Data Source
AI summary
An apparatus for processing wafer-shaped articles includes a rotary chuck adapted to hold a wafer-shaped article of a predetermined diameter thereon. A radiant heating plate faces a wafer-shaped article when positioned on the rotary chuck. The radiant heating plate includes radiant heating elements, but a central region of the radiant heating plate is free of radiant heating elements. The radiant heating plate further includes at least one refraction element that refracts radiation emitted by the radiant heating elements and passed through the at least one refraction element, toward the central region of the radiant heating plate.