Radiant Heating Chuck for High-Temperature Wafer Clamping
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Solution Overview
Problem
Conventional electrostatic chucks face challenges at elevated temperatures above 600° C, experiencing reduced clamping force and compromised structural integrity due to increased leakage.
Innovation Solution
A chuck design featuring a hollow cylindrical housing with a heat source and electrodes for radiative heating, a clamp ring for secure clamping, and a thermal sensor for temperature control, allowing the workpiece to be heated to over 600° C while maintaining the chuck components at a lower temperature, such as room temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If conventional electrostatic chucks are used to clamp semiconductor workpieces, then clamping force is sufficient at room temperature, but clamping force reduces significantly at temperatures above 600° C due to increased leakage
Solution Approach 1:
The system is divided into two temperature zones: the chuck housing and components remain at room temperature while only the workpiece is heated to high temperatures. This segmentation allows electrostatic clamping to function effectively at room temperature while the workpiece receives the required thermal processing temperature.
Solution Approach 2:
A radiant heat source positioned behind the workpiece serves as an intermediary heating mechanism. The heat source radiates thermal energy through the workpiece without directly contacting the chuck components, enabling workpiece heating while maintaining chuck components at room temperature and preserving clamping force.
2Temperature
If the chuck components are heated to high temperatures along with the workpiece, then the workpiece can be heated to over 600° C, but structural integrity of the chuck is compromised
Solution Approach 1:
The system separates the thermal processing zone from the mechanical support zone. The workpiece is heated to high temperatures while the chuck housing, electrodes, and control components remain at room temperature, preserving their structural integrity while enabling high-temperature processing of the workpiece.
Solution Approach 2:
Radiant heating serves as an intermediary mechanism that transfers thermal energy to the workpiece without requiring direct thermal contact with the chuck components. The radiant heat source positioned behind the workpiece allows selective heating of the workpiece while the chuck structure remains cool and structurally sound.
3Temperature
If conventional chucks are exposed to high temperatures, then the workpiece can be processed at elevated temperatures, but leakage increases and clamping force is reduced
Solution Approach 1:
The system divides the thermal environment into two distinct zones: the workpiece experiences high processing temperatures while the chuck components operate at room temperature. This segmentation ensures that electrostatic clamping mechanisms maintain their reliability and clamping force, while the workpiece receives the necessary thermal processing conditions.
Solution Approach 2:
Radiant heating acts as an intermediary that delivers thermal energy to the workpiece without exposing the chuck components to high temperatures. This approach maintains the reliability of electrostatic clamping by keeping the chuck components cool, while still achieving the required processing temperature for the workpiece.
4Temperature
If the chuck is heated to high temperatures, then the workpiece can be heated efficiently, but thermal stress and particle generation increase
Solution Approach 1:
The system segments the thermal loading so that only the workpiece is subjected to high temperatures while the chuck components remain at room temperature. This eliminates thermal stress on the chuck structure and prevents particle generation from thermal degradation of chuck components, while still achieving efficient heating of the workpiece through radiant energy transfer.
Solution Approach 2:
Radiant heating serves as an intermediary mechanism that transfers thermal energy directly to the workpiece without requiring the chuck components to be heated. This approach achieves efficient heating of the workpiece while avoiding thermal stress and particle generation in the chuck components, as they remain at room temperature throughout the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chuck effectively clamps and heats semiconductor workpieces to temperatures exceeding 700° C without compromising the structural integrity of the chuck, reducing thermal stress and particle generation, and minimizing heat flow to the chuck, thus extending its lifespan and reducing downtime.
Implementation Method 1
A heat source is disposed in the cavity and emits radiated heat toward the workpiece
Implementation Method 2
an electrostatic force generated by the one or more electrodes attracts the plurality of tabs toward the top surface
Data Source
AI summary
A chuck for heating and clamping a workpiece, such as a semiconductor workpiece, is disclosed. The chuck is configured to allow the workpiece to be heated to temperatures in excess of 600° C. Further, while the workpiece is heating, the components that make up the chuck may be maintained at a much lower temperature, such as room temperature. The chuck includes a housing, formed as a hollow cylinder with sidewalls and an open end. Electrodes are disposed at the top surface of the sidewalls to clamp the workpiece. A heat source is disposed in the cavity and emits radiated heat toward the workpiece. A clamp ring may be used to secure the workpiece. In some embodiments, a thermal sensor is used to monitor the temperature of the workpiece.