Semiconductor Chip Alignment Using Radiation for Precise Bonding
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Solution Overview
Problem
Current semiconductor chip alignment methods for packaging rely on optical alignment, which is prone to mechanical movement errors, leading to lower yield and accuracy issues, especially in nanometer-scale processes.
Innovation Solution
An apparatus and method utilizing a radiation source and sensor to align and bond semiconductor chips, allowing continuous fine alignment and reducing production costs by improving precision and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If optical alignment method is used to align semiconductor chips, then the alignment process is simple and fast, but mechanical movement errors cause lower bonding accuracy
Solution Approach 1:
The patent replaces the optical alignment method with a radiation-based alignment method. Instead of using optical cameras and mechanical positioning systems that are prone to movement errors, the invention uses radiation sources and sensors to detect chip positions and patterns, providing more stable and accurate alignment that is not affected by mechanical instability.
Solution Approach 2:
The patent introduces radiation (X-rays or other penetrating radiation) as an intermediary to achieve alignment. The radiation passes through the chips and interacts with alignment marks or internal structures, allowing precise position detection without direct mechanical contact or optical surface reflection, thereby eliminating mechanical movement errors.
2Manufacturing precision
If radiation is used to irradiate the entire semiconductor chip area for alignment, then alignment precision is maximized, but the risk of chip damage increases
Solution Approach 1:
The patent applies radiation only to specific local areas of the chip where alignment marks or critical features are located, rather than irradiating the entire chip surface. This localized approach maintains high alignment precision at the critical regions while minimizing the total radiation dose and reducing the risk of damage to other chip areas.
Solution Approach 2:
The patent uses partial action by directing radiation only at the necessary alignment regions rather than the complete chip area. This selective irradiation provides sufficient alignment information while avoiding excessive radiation exposure that could damage sensitive chip components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances bonding accuracy and increases production yield by using radiation detection for precise alignment, reducing the risk of damage to semiconductor chips and improving price competitiveness.
Implementation Method 1
a radiation source configured to irradiate a plurality of semiconductor chips with radiation
Implementation Method 2
a radiation sensor configured to detect the radiation that has penetrated the plurality of semiconductor chips
Data Source
AI summary
Disclosed in the present document is an apparatus for aligning a semiconductor chip for packaging according to an embodiment, the apparatus may include a radiation source configured to irradiate a plurality of semiconductor chips with radiation; the plurality of semiconductor chips vertically disposed with respect to the ground; a radiation sensor configured to detect the radiation that has penetrated the plurality of semiconductor chips; and an alignment unit configured to align and bond the plurality of semiconductor chips based on detection information acquired by the radiation sensor.