Radiation Imaging Chip Layout for Higher-Yield Detector Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In radiation imaging devices, increasing the area of effective pixel regions by arranging multiple radiation detectors on a circuit board leads to higher chances of defective attachment, resulting in reduced yield due to increased assembly complexity.
Innovation Solution
The design incorporates charge generation chips with signal connection wirings that straddle first and second reading chips, allowing for easy electrical connection without the need for bonding pads or through silicon vias, reducing mechanical stress and assembly errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple radiation detectors are arranged on a circuit board to increase effective pixel regions, then the area of effective pixel regions is improved, but the likelihood of defective attachment work increases and yield decreases
Solution Approach 1:
The patent merges the charge generation chip with signal connection wirings into a single integrated component. The charge generation chip includes both the charge generation region and the signal connection wirings that extend from the first output region to the second output region, eliminating the need for separate wiring attachments and reducing assembly steps.
Solution Approach 2:
The charge generation chip serves multiple functions: it generates charges from incident radiation and simultaneously provides signal connection pathways between adjacent reading chips. This multi-functional design reduces the number of components and assembly operations required.
2Area of stationary object
If multiple radiation detectors are arranged on a circuit board to increase effective pixel regions, then the area of effective pixel regions is improved, but the complexity of assembly work increases
Solution Approach 1:
The charge generation chip integrates both charge generation functionality and signal connection pathways into a single component. The signal connection wirings are formed within the charge generation chip itself, extending from the first output region to the second output region, eliminating the need for separate wiring attachments.
Solution Approach 2:
The signal connection wirings are pre-formed within the charge generation chip during its manufacturing process, before the chip is attached to the reading chips. This preliminary formation of connection pathways simplifies the subsequent assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the assembly process, reduces defective products, and enhances the mechanical strength of the radiation imaging device while maintaining efficient pixel region coverage.
Implementation Method 1
charge generation chips configured to generate charges corresponding to an energy or the number of particles of incident radiation
Data Source
AI summary
A radiation imaging device includes charge generation chips configured to generate charges, reading chips configured to output a digital value based on the charges, and a circuit board configured to have the reading chips arranged thereon. The charge generation chips each have a charge output surfaces including a first output region facing the reading chip and a second output region facing a different reading chip. The reading chips each have signal input/output electrodes. The charge generation chips each have signal connection wirings extending from the first output region to the second output region and electrically connecting the signal input/output electrodes of the reading chip to the signal input/output electrodes of the different reading chip.