Radiation Curable Silicone Composition for Release Paper
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Solution Overview
Problem
Cation polymerizable silicone compositions for release paper face challenges in achieving good release properties from pressure-sensitive adhesives while maintaining tenacious adhesion to substrates, due to low epoxy group modification and high siloxane content, leading to unwanted peeling of the cured coating.
Innovation Solution
A radiation curable silicone composition comprising a cation polymerizable organopolysiloxane with a siloxane chain terminated with an epoxy group, combined with a fluoroalkyl fluorophosphoric acid salt or diaryliodonium hexafluoroantimonate as the photoacid generator, which enhances solubility and adhesion properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the silicone content is increased to ensure easy release from pressure-sensitive adhesives, then release properties are improved, but substrate adhesion deteriorates causing the cured coating to peel off
Solution Approach 1:
The invention changes the chemical parameters of the organopolysiloxane by introducing specific epoxy-containing organic groups (formula (2)) with controlled structural parameters (n=1-10, Y being specific hydrocarbon groups). This parameter optimization allows the coating to achieve both release properties and substrate adhesion simultaneously, resolving the contradiction between these two opposing requirements.
Solution Approach 2:
The invention creates a composite structure within the organopolysiloxane molecule by combining siloxane chains with epoxy-containing organic groups. This molecular composite approach enables the material to exhibit dual functionality: release properties from the siloxane component and adhesion from the epoxy component, thereby resolving the contradiction between release and adhesion.
2Strength
If the degree of epoxy group modification is increased to enhance substrate adhesion, then adhesion is improved, but solubility of the photoacid generator deteriorates
Solution Approach 1:
The invention optimizes the structural parameters of the epoxy-containing organic group, specifically controlling the value of n (1-10) and the type of hydrocarbon group Y. This parameter control balances the epoxy content to provide sufficient adhesion while maintaining appropriate solubility for the photoacid generator, resolving the contradiction between adhesion and solubility.
3Reliability
If cation polymerizable silicone compositions are used for release paper application, then release properties are improved, but the cured coating peels off the substrate due to low epoxy group modification
Solution Approach 1:
The invention changes the chemical composition parameters by incorporating epoxy-containing organic groups with specific structural parameters (formula (2)) into the organopolysiloxane. This composition optimization enables the cation polymerizable silicone to simultaneously achieve release properties and tenacious adhesion to substrates, resolving the peeling issue.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively cures upon radiation exposure, providing good release properties and tenacious adhesion, even under thin-film coating conditions, making it suitable for commercial applications in release paper and other substrates.
Implementation Method 1
a radiation curing system via cationic polymerization using a photoacid generator (PAG) for ring-opening of epoxy groups
Implementation Method 2
a radiation curing system via cationic polymerization using a photoacid generator (PAG) for ring-opening of epoxy groups
Data Source
AI summary
An organopolysiloxane whose siloxane chain is terminated with an epoxy group is combined with a fluoroalkyl fluorophosphoric acid salt or diaryliodonium hexafluoroantimonate as the photoacid generator. A radiation curable silicone composition is obtained which exhibits good release properties from pressure-sensitive adhesives and tenacious adhesion to substrates.