Radiation Detector With Compensating Sensor And Internal Blocking Layer
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Solution Overview
Problem
Radiation sensors face challenges in accurately converting radiative signals due to external factors such as noise, temperature changes, and pressure variations, which existing reference sensors struggle to fully compensate for, especially in complex multi-domain conversions like thermopile sensors.
Innovation Solution
A chip design featuring a first sensor and a second reference sensor, where the second sensor is isolated from radiation by an internal layer within a cavity, allowing it to provide a baseline signal for noise and drift cancellation, while maintaining the same external parameters except for object radiation, ensuring accurate radiation-induced signal derivation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a reference sensor is used to compensate for external factors, then measurement precision is improved, but device complexity increases due to the need for additional sensors and compensation mechanisms
Solution Approach 1:
The device is segmented into two functionally distinct sensors: a measurement sensor that receives radiation and a reference sensor that is isolated from radiation. This segmentation allows each sensor to perform its specific function while together they enable compensation of external factors, resolving the contradiction between improved measurement precision and increased device complexity.
Solution Approach 2:
An internal layer acts as an intermediary element that selectively blocks radiation from reaching the reference sensor while allowing the measurement sensor to receive radiation. This intermediary structure enables the reference sensor to measure only environmental parameters without radiation interference, facilitating accurate compensation while maintaining a manageable device architecture.
2Reliability
If the reference sensor is exposed to the same environment as the measurement sensor, then compensation for external factors is improved, but radiation interference in the reference sensor increases
Solution Approach 1:
The internal layer is positioned specifically between the radiation source and the reference sensor, creating a localized radiation-blocking zone. This local quality modification allows the reference sensor to remain in the same environmental conditions as the measurement sensor for temperature and pressure compensation, while selectively excluding radiation interference through the internal layer's specific placement and properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively cancels out unwanted effects like noise and drift, and common-mode radiation, enhancing the accuracy of radiation measurements by using the second sensor as a reference to calibrate out errors, while maintaining identical pressure and thermal conditions for both sensors.
Implementation Method 1
An internal layer preventing radiation from reaching the second sensor is present on the inside of the second cavity
Implementation Method 2
The conversion of the radiative signal into an electrical signal is a multi-stage conversion in which not only the thermo-electrical domain but also the optical domain and the thermal domain should be considered
Implementation Method 3
With regard to the optical domain, the electromagnetic radiation in the infrared spectral range and the absorption of the radiation onto a MEMS element should be considered
Implementation Method 4
With regard to the thermal domain, the heat transfer through conduction, convection and radiation should be considered
Data Source
AI summary
A chip for radiation measurements, the chip comprising a first substrate comprising a first sensor and a second sensor. The chip moreover comprises a second substrate comprising a first cavity and a second cavity both with oblique walls. An internal layer is present on the inside of the second cavity. The second substrate is sealed to the first substrate with the cavities on the inside such that the first cavity is above the first sensor and the second cavity is above the second sensor.