Radiation Detector IC Mounting Heat Dissipation
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Solution Overview
Problem
Existing radiation detector modules require additional substrates for IC attachment, leading to unnecessary steps, material waste, and reduced heat dissipation due to encapsulated IC substrates.
Innovation Solution
The IC layer is positioned below the photodiode layer and connected using wire-bonding, with the bottom part of the IC layer exposed for improved heat conduction and without an additional substrate, allowing for direct contact with a heat sink and potentially using a redistribution layer for easier manufacturing and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the IC is attached to a separate substrate using soldering, then the IC is securely mounted and electrically connected, but additional substrates and packaging materials are required, increasing device complexity and material waste
Solution Approach 1:
The patent merges the IC mounting function directly onto the detector substrate by creating through-substrate conductive paths. The IC is positioned on one side of the substrate while its electrical contacts are connected to the photodiode layer through conductive vias formed through the substrate, eliminating the need for a separate IC substrate and reducing overall device complexity while maintaining secure mounting and electrical connection.
2Reliability
If the IC is fully encapsulated in protective material, then the wire-bonding is protected, but heat conduction away from the IC is reduced
Solution Approach 1:
The patent applies local quality by providing selective protection rather than full encapsulation. The protective material covers only the wire-bonding connections to protect them from environmental damage, while deliberately leaving the bottom surface of the IC exposed. This localized approach maintains wire-bonding protection while preserving thermal pathways for heat dissipation through the substrate to the heat sink.
3Reliability
If additional substrates and packaging are used for IC attachment, then the IC is protected and connected, but material waste increases and manufacturing steps are added
Solution Approach 1:
The patent extracts and eliminates the unnecessary IC substrate and packaging layers from the traditional detector structure. By forming conductive vias directly through the detector substrate to connect the IC, the design removes redundant material layers, reducing material waste and simplifying the manufacturing process while maintaining reliable electrical connection between the IC and photodiode layer.
4Temperature
If the bottom part of the IC layer is exposed, then heat conduction is improved, but the IC may be more vulnerable to environmental factors
Solution Approach 1:
The patent applies local quality by providing selective protection rather than full encapsulation. The protective material covers only the wire-bonding connections to protect them from environmental damage, while deliberately leaving the bottom surface of the IC exposed. This localized approach maintains wire-bonding protection while preserving thermal pathways for heat dissipation through the substrate to the heat sink.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces material waste, improves heat dissipation, and eliminates the need for additional substrates, resulting in a more compact and cost-effective radiation detector module.
Implementation Method 1
a scintillator layer configured to convert x-ray or gamma ray photons into photons of visible light
Implementation Method 2
a photodiode layer configured to convert visible light generated by the scintillator layer into an electric current
Implementation Method 3
leaving the bottom part of the IC layer exposed can significantly improve heat conduction away from the device
Data Source
AI summary
According to an embodiment, a device comprises: a scintillator layer configured to convert x-ray or gamma ray photons into photons of visible light; a photodiode layer configured to convert visible light produced by the scintillator layer into an electric current; an integrated circuit, IC, layer situated below the photodiode layer and configured to receive and process the electric current; wherein electrical contacts of the IC layer are connected to electrical contacts of the photodiode layer using wire-bonding; and wherein the wire-bonding is covered with a protective material while bottom part of the IC layer is left at least partly exposed. Other embodiments relate to a detector comprising an array of tiles according to the device; and an imaging system comprising: an x-ray source and the detector.